Polishing head, and polishing treatment device

A polishing head that is provided in a polishing treatment device having a polishing pad that rotates horizontally, holds a substrate to be polished, and brings a polished surface of the substrate into sliding contact with the polishing pad, comprising:

• a head housing that has
• a first flange part that extends outward from an upper position of a circumferential surface of a cylindrical body and
• a second flange part that extends outward from a lower position of the circumferential surface;
• an annular body that is sized to surround an outer circumference of the second flange part and has a third flange part that is formed at an upper end part thereof and located between the first flange part and the second flange part;
• an elastic body that covers a lower end-side opening part of the annular body and holds the substrate with a backing film pasted to a front surface thereof interposed therebetween;
• a retainer ring formed in a shape to surround an outer circumference of the substrate;
• driving means that integrally horizontally rotates the head housing, the annular body, and the retainer ring;
• an annular elastic body being arranged on a back surface of the elastic body;
• and a corrective pressing ring that applies a pressure to an upper surface of the annular elastic body being arranged inside the annular body,
• the polishing head further comprising:
• first pressure adjusting means that adjusts a processing pressure applied to a back side of the substrate opposite to the polished surface by adjusting a pressure in a space surrounded by the head housing, the annular body, and the elastic body;
• second pressure adjusting means that adjusts a pressure applied to the polishing pad by the retainer ring by means of the first flange part;
• third pressure adjusting means that adjusts, by means of the second flange part, a pressurized area in which the processing pressure is applied to a back-side circumference of the substrate opposite to the polished surface by raising or lowering the annular body via the third flange part;
• and
• fourth pressure adjusting means that adjusts, by means of the second flange, a compensating pressure applied to a back-side outer circumference vicinity of the substrate opposite to the polished surface by the corrective pressing ring via the annular elastic body;
• wherein as a first step,
• the first pressure adjusting means applies the processing pressure to the back side of the substrate opposite to the polished surface,
• the second pressure adjusting means applies the pressure to the polishing pad, and
• the third pressure adjusting means raises the annular body to reduce the processing pressure on the back-side circumference of the substrate opposite to the polished surface compared with the processing pressure applied by the first pressure adjusting means, and
• as a second step,
• the first pressure adjusting means stops applying the processing pressure,
• the second pressure adjusting means applies the pressure to the polishing pad,
• the third pressure adjusting means lowers the annular body to stop reducing the processing pressure on the back-side circumference of the substrate opposite to the polished surface, and
• the fourth pressure adjusting means applies the compensating pressure to the back-side outer circumference vicinity of the substrate opposite to the polished surface.

A polishing treatment method by a polishing head that is provided in a polishing treatment device having a polishing pad that rotates horizontally, holds a substrate to be polished, and brings a polished surface of the substrate into sliding contact with the polishing pad,

• wherein the polishing head comprises:
• a head housing that has
• a first flange part that extends outward from an upper position of a circumferential surface of a cylindrical body and
• a second flange part that extends outward from a lower position of the circumferential surface;
• an annular body that is sized to surround an outer circumference of the second flange part and has a third flange part that is formed at an upper end part thereof and located between the first flange part and the second flange part;
• an elastic body that covers a lower end-side opening part of the annular body and holds the substrate with a backing film pasted to a front surface thereof interposed therebetween;
• a retainer ring formed in a shape to surround an outer circumference of the substrate;
• driving means that integrally horizontally rotates the head housing, the annular body, and the retainer ring;
• an annular elastic body being arranged on a back surface of the elastic body;
• and
• a corrective pressing ring that applies a pressure to an upper surface of the annular elastic body being arranged inside the annular body,
• the polishing head further comprises:
• first pressure adjusting means that adjusts a processing pressure applied to a back side of the substrate opposite to the polished surface by adjusting a pressure in a space surrounded by the head housing, the annular body, and the elastic body;
• second pressure adjusting means that adjusts a pressure applied to the polishing pad by the retainer ring by means of the first flange part;
• third pressure adjusting means that adjusts, by means of the second flange part, a pressurized area in which the processing pressure is applied to a back-side circumference of the substrate opposite to the polished surface by raising or lowering the annular body via the third flange part;
• and
• fourth pressure adjusting means that adjusts, by means of the second flange part, a compensating pressure applied to a back-side outer circumference vicinity of the substrate opposite to the polished surface by the corrective pressing ring via the annular elastic body, and
• the polishing treatment method comprises:
• a first step for controlling, by a processor,
• the first pressure adjusting means to apply the processing pressure to the back side of the substrate opposite to the polished surface,
• the second pressure adjusting means to apply the pressure to the polishing pad, and
• the third pressure adjusting means to raise the annular body to reduce the processing pressure on the back-side circumference of the substrate opposite to the polished surface compared with the processing pressure applied by the first pressure adjusting means;
• and
• a second step for controlling, by the processor,
• the first pressure adjusting means to stop applying the processing pressure,
• the second pressure adjusting means to apply the pressure to the polishing pad,
• the third pressure adjusting means to lower the annular body to stop reducing the processing pressure on the back-side circumference of the substrate opposite to the polished surface, and
• the fourth pressure adjusting means to apply the compensating pressure to the back-side outer circumference vicinity of the substrate opposite to the polished surface.