Adhesive residue removal apparatus and adhesive residue removal method
AssigneeMicro Engineering Inc.
InventorsKazuya WATANABE, Hajime TOMIZAWA, Shuichi NOZAWA
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AssigneeMicro Engineering Inc.
InventorsKazuya WATANABE, Hajime TOMIZAWA, Shuichi NOZAWA
Estimating the term…
The present invention provides an adhesive residue removal apparatus capable of removing pellicle adhesive residue efficiently without damaging a pattern surface. An adhesive residue removal apparatus for removing organic matter existing as pellicle adhesive residue on a surface of a reticle when a pellicle is separated from the reticle includes a head adapted to generate atmospheric pressure plasma and emit the generated atmospheric pressure plasma to organic matter existing on a surface of a workpiece W; and a control unit adapted to control the atmospheric pressure plasma under irradiation conditions as the atmospheric pressure plasma is emitted from the head to remove the pellicle adhesive residue from the surface of the workpiece.
An adhesive residue removal apparatus for removing organic matter existing as pellicle adhesive residue on a surface of a reticle when a pellicle is separated from the reticle, the apparatus comprising:
An adhesive residue removal method for removing adhesive residue remaining on a reticle when a pellicle is separated from the reticle, the method comprising:
Dependencies are inferred from the claim text.