Polishing head and polishing treatment device

Abstract

Provided is a polishing head and a polishing treatment device that can cope with the wrinkle phenomenon, the star mark phenomenon and the like, further improve the SFOR or the like of the substrate surface and steadily perform a polishing treatment of a large number of substrates with high quality. A polishing head 100 includes a membrane support ring 3, a membrane 4 that covers a lower end-side opening part of the membrane support ring 3 and holds a substrate W with a backing film 5 pasted to a front surface side thereof interposed therebetween, and a retainer ring 6 shaped to accommodate the membrane support ring 3 and surround the outer circumference of the substrate W. On the back surface side of the membrane 4, a plurality of radial ribs 4a that radially extend from the vicinity of the center of the membrane 4 and a circular rib 4b that is shaped to have a size smaller than the size of the elastic body are formed, and the radial ribs 4a are formed to radially extend outward from the circular rib 4b. In a region defined by adjacent radial ribs 4a, the membrane support ring 3 and the circular rib 4b on the back surface side of the elastic body, a rib lock member 33 shaped to be in contact with the side surfaces of the adjacent radial ribs 4a, the inner circumferential surface of the membrane support ring 3 and the outer circumferential surface of the circular rib 4b is arranged.

Dependencies are inferred from the claim text.