Mcnc
Research Triangle Park, NC, US· latest recorded location
MCNC is named on 96 US grants and 12 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 96
- Published applications
- 12
- Inventors
- 81
- Granted in 2026 so far
- 0
- Most recent grant
- 14 Jun 2005
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 10 | 0 |
| 1992 | 10 | 0 |
| 1993 | 5 | 0 |
| 1994 | 7 | 0 |
| 1995 | 10 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 11 | 0 |
| 2000 | 9 | 0 |
| 2001 | 6 | 0 |
| 2002 | 8 | 2 |
| 2003 | 7 | 3 |
| 2004 | 4 | 7 |
| 2005 | 1 | 0 |
By publication year.
Technology areas
Share of 108 documents
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by34
- G02BOptical elements, systems or apparatus23
- Y10TTechnical subjects covered by former us classification17
- B81BMicrostructural devices or systems16
- H01HElectric switches16
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered16
- H05KPrinted circuits15
- Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests12
- H01JElectric discharge tubes or discharge lamps11
- H10DInorganic electric semiconductor devices10
Recent patents
- Three dimensional multimode and optical coupling devices14 Jun 2005US 6,906,598 B2
- Impedance control devices for use in the transition regions of electromagnetic and optical circuitry and methods for using the same14 Dec 2004US 6,832,029 B2
- Flexible optoelectronic circuit and associated method13 Jul 2004US 6,763,156 B2
- Miniature electrical relays using a piezoelectric thin film as an actuating element2 Mar 2004US 6,700,309 B2
- Scanning apparatus and associated method20 Jan 2004US 6,680,788 B1
- Three dimensional multimode and optical coupling devices9 Dec 2004US 2004/0246065 A1
- Through-via vertical interconnects, through-via heat sinks and associated fabrication methods14 Oct 2004US 2004/0201095 A1
- Three dimensional multimode and optical coupling devices1 Jul 2004US 2004/0124943 A1
- Impedance control devices for use in the transition regions of electromagnetic and optical circuitry and methods for using the same17 Jun 2004US 2004/0114868 A1
- Optical-inclusive dWDM local area network15 Apr 2004US 2004/0071469 A1
Most cited
By later US patents
- Vertical microelectronic field emission devices312US 5,475,280 A1995
- Microelectromechanical devices including rotating plates and related methods200US 5,914,801 A1999
- Thermal arched beam microelectromechanical switching array171US 5,955,817 A1999
- Solder bump fabrication methods and structure including a titanium barrier layer165US 5,767,010 A1998
- High performance integrated circuit chip package158US 5,325,265 A1994