High performance integrated circuit chip package

An integrated circuit chip package comprising:

• a plurality of integrated circuit chips, each having a front face and a back face;
• a first ceramic block having conductors extending therethrough from one face to the opposite face thereof, said first ceramic block being free of power, ground and signal panes therein;
• input/output connectors, electrically connected to respective conductors on said one face of said first ceramic block, for providing electrical connection to a next level of packaging;
• a multilayer wiring substrate on said opposite face of said first ceramic block, said multilayer wiring substrate comprising a plurality of insulating layers having conductive vias and conductive power, ground and signal planes therein, for providing power, ground and signal connections from said conductors;
• controller collapse chip connections for rigidly mounting the front face of said integrated circuit chips on said multilayer wiring substrate;
• a second ceramic block having microchannels formed therein at one face thereof for transporting cooling fluid therein, said second ceramic block being rigidly mounted on said first ceramic block such that said one face is disposed adjacent, and a predetermined fixed distance from, said back faces of said integrated circuit chips mounted on said multilayer wiring substrate;
• and
• a plurality of layers of indium or an alloy thereof, a respective one of which extends between a respective one of said back faces of said integrated circuit chips and said one face of said second block of ceramic, each layer of indium or an alloy thereof being sufficiently thin to efficiently conduct heat from said chips to said second block but sufficiently thick to absorb dimensional variations and thermal expansions in said package which result from the rigid mounting of said controlled collapse chip connections between said integrated circuit chips and said multilayer wiring substrate and from rigidly mounting said second ceramic block on said first ceramic block.