Material Concept, Inc.
Miyagi, JP· latest recorded location
MATERIAL CONCEPT, INC. is named on 11 US grants and 13 published applications in this corpus. Its most frequent classification is H05K (Printed circuits).
- Granted patents
- 11
- Published applications
- 13
- Inventors
- 8
- Granted in 2026 so far
- 0
- Most recent grant
- 2 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2015 | 0 | 1 |
| 2016 | 0 | 1 |
| 2017 | 1 | 1 |
| 2018 | 1 | 3 |
| 2019 | 2 | 1 |
| 2020 | 1 | 0 |
| 2021 | 0 | 1 |
| 2022 | 2 | 2 |
| 2023 | 1 | 1 |
| 2024 | 1 | 1 |
| 2025 | 2 | 0 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 24 documents
- H05KPrinted circuits12
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by11
- B22FWorking metallic powder10
- H10FSolar cells and light sensors9
- Y02EClean energy generation and storage9
- H01BCables7
- C22CAlloys4
- B05DProcesses for applying fluent materials to surfaces, in general2
- C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds2
- C04BLime, magnesia2
Recent patents
- Copper paste2 Dec 2025US 12,485,478 B2
- Wiring board and method for manufacturing same8 Jul 2025US 12,356,542 B2
- Electronic component and method for producing same13 Feb 2024US 11,903,144 B2
- Circuit board and production method therefor, and electronic device and production method therefor31 Jan 2023US 11,570,899 B2
- Wiring structure and semiconductor device18 Oct 2022US 11,476,195 B2
- Copper paste8 Oct 2026US 2026/0307143 A1
- Copper paste11 Apr 2024US 2024/0116105 A1
- Wiring board and method for manufacturing same23 Feb 2023US 2023/0056971 A1
- Copper oxide paste and method for producing electronic parts20 Oct 2022US 2022/0332958 A1
- Electronic component and method for producing same3 Mar 2022US 2022/0071024 A1
Most cited
By later US patents