Wiring board and method for manufacturing same
AssigneeMaterial Concept, Inc.
InventorsJunichi Koike, Tri Hai Hoang
Life of this patent
Estimating the term…
Abstract
Provided are: a novel wiring board having flexibility derived from a resin board and the high electrical conductivity derived from a metal wiring as well as high adhesion between the metal wiring and the insulating resin board; and a method for manufacturing the wiring board without using a photolithography process. A wiring board according to the present invention comprises a resin board and a metal wiring, the metal wiring including a sintered body of metal particles, the sintered body including a plurality of voids having opening portions extending toward the resin board, parts of the resin board entering the voids from the opening portions.
Claims10
A wiring board comprising:
- a resin board and a metal wiring,
- the metal wiring including a sintered body of metal particles,
- the sintered body including a plurality of voids having opening portions extending toward the resin board,
- parts of the resin board entering the voids from the opening portions,
- wherein a surface of the sintered body is coated with a resin surface layer, and
- the surface is located on a side opposite to a boundary interface in contact with the resin board.
A method for manufacturing a wiring board including a resin board and a metal wiring containing a sintered body of metal particles, the method comprising:
- forming the sintered body on a sintering member;
- applying, on the sintering member, a solution including a resin component to a surface of the sintered body and around the sintered body;
- curing the resin component to form the resin board;
- and
- separating the sintered body and the resin board from the sintering member,
- wherein the sintered body includes a plurality of voids having opening portions extending toward the resin board,
- parts of the resin board enters the voids from the opening portions, and
- a surface of the sintered body is coated with a resin surface layer, and
- the surface is located on a side opposite to a boundary interface in contact with the resin board.
A method for manufacturing a wiring board including a resin board and a metal wiring containing a sintered body of metal particles, the method comprising:
- providing the resin board;
- and
- forming the sintered body on the resin board,
- wherein the sintered body includes a plurality of voids having opening portions extending toward the resin board,
- parts of the resin board enters the voids from the opening portions, and
- a surface of the sintered body is coated with a resin surface layer, and
- the surface is located on a side opposite to a boundary interface in contact with the resin board.
Dependencies are inferred from the claim text.