Back to results
US 12,485,478 B2Granted
Copper paste
AssigneeMaterial Concept, Inc.
InventorJunichi Koike
Life of this patent
Estimating the term…
Abstract
Provided is a copper paste containing a copper powder and an organic solvent, wherein the organic solvent is an alcohol-based solvent containing one or more first alcohols selected from the group consisting of monohydric and dihydric alcohols having a viscosity at 20° C. of 30-70 mPa·s, and one or more second alcohols selected from the group consisting of dihydric and trihydric alcohols having a viscosity at 20° C. of 300-1000 mPa·s.
Claims13
A copper paste comprising:
- copper particles;
- and an organic solvent, wherein:
- the organic solvent is an alcohol-based solvent comprising:
- at least one first alcohol selected from the group consisting of 1-hexanol, 1-heptanol, 2-heptanol, 2-octanol, 2-ethyl-1-hexanol, benzyl alcohol, hexylene glycol, 1,2-propanediol, 1,3-propanediol, and ethylene glycol;
- and
- at least one second alcohol selected from the group consisting of dihydric and trihydric alcohols having a viscosity of 300 mPa·s or more and 1,000 mPa·s or less at 20° C.;
- and
- the copper particles have a coating layer on at least a part of their surface, wherein the coating layer comprises a polysaccharide, nonanoic acid, decanoic acid, dodecanoic acid, tetradecanoic acid, or a mixture thereof.
5 more elements
A copper paste comprising:
- copper particles;
- and an organic solvent, wherein:
- the organic solvent is an alcohol-based solvent comprising:
- at least one first alcohol selected from the group consisting of hexylene glycol, 1,2-propanediol, 1,3-propanediol, 2,3-butanediol, triethylene glycol, diethylene glycol, and ethylene glycol;
- and
- at least one second alcohol selected from the group consisting of dihydric and trihydric alcohols having a viscosity of 300 mPa·s or more and 1,000 mPa·s or less at 20° C.;
- and
- the copper particles have a coating layer on at least a part of their surface, wherein the coating layer comprises a polysaccharide, nonanoic acid, decanoic acid, dodecanoic acid, tetradecanoic acid, or a mixture thereof.
5 more elements
A copper paste comprising:
- copper particles;
- and an organic solvent, wherein:
- the organic solvent is an alcohol-based solvent comprising:
- at least one first alcohol selected from the group consisting of monohydric and dihydric alcohols having a viscosity of 3 mPa·s or more and 70 mPa·s or less at 20° C.;
- and
- at least one second alcohol selected from the group consisting of dihydric and trihydric alcohols having a viscosity of 300 mPa·s or more and 1,000 mPa·s or less at 20° C.;
- and
- the copper particles have a coating layer on at least a part of their surface, wherein the coating layer comprises a polysaccharide.
5 more elements
Dependencies are inferred from the claim text.