Cusic Inc.
Miyagi, JP· latest recorded location
CUSIC INC. is named on 8 US grants and 8 published applications in this corpus. Its most frequent classification is H10P (Generic processes or apparatus for the manufacture or treatment of devices covered).
- Granted patents
- 8
- Published applications
- 8
- Inventors
- 3
- Granted in 2026 so far
- 0
- Most recent grant
- 2 Jan 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2018 | 0 | 3 |
| 2019 | 1 | 2 |
| 2020 | 3 | 2 |
| 2021 | 2 | 0 |
| 2022 | 1 | 0 |
| 2023 | 0 | 1 |
| 2024 | 1 | 0 |
By publication year.
Technology areas
Share of 16 documents
Recent patents
- SiC multilayer body, production method therefor, and semiconductor device2 Jan 2024US 11,862,460 B2
- Silicon carbide substrate production method and silicon carbide substrate31 May 2022US 11,346,018 B2
- SiC composite substrate and method for manufacturing same28 Dec 2021US 11,208,719 B2
- Compound semiconductor laminate substrate, method for manufacturing same, and semiconductor element16 Nov 2021US 11,177,123 B2
- Manufacturing method of SiC composite substrate10 Nov 2020US 10,829,868 B2
- Sic multilayer body, production method therefor, and semiconductor device21 Sep 2023US 2023/0298886 A1
- Sic composite substrate and method for manufacturing same14 May 2020US 2020/0149189 A1
- Compound semiconductor laminate substrate, method for manufacturing same, and semiconductor element2 Jan 2020US 2020/0006046 A1
- Silicon carbide substrate production method and silicon carbide substrate19 Dec 2019US 2019/0382918 A1
- Method for producing sic composite substrate23 May 2019US 2019/0157087 A1
Most cited
By later US patents