US 2020/0006046 A1 · COMPOUND SEMICONDUCTOR LAMINATE SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR ELEMENT

Abstract

A compound semiconductor laminate substrate comprising two single-crystalline compound semiconductor substrates directly bonded together and laminated, the single-crystalline compound semiconductor substrates having the same composition including A and B as constituent elements and having the same atomic arrangement, characterized in that the front and back surfaces of the laminate substrate are polar faces comprising the same kind of atoms of A or B, and that a laminate interface comprises a bond of atoms of either B or A and is a unipolar anti-phase region boundary plane in which the crystal lattices of the atoms are matched. In this way, the polar faces of the front and rear surfaces of the compound semiconductor laminate substrate are made monopolar, thereby facilitating semiconductor element process designing, and making it possible to manufacture a low-cost, high-performance, and stable semiconductor element without implementing complex substrate processing.

Claims15

Dependent claims

A compound semiconductor laminated substrate comprising:

two single-crystalline compound semiconductor substrates each containing A and B as constituent elements and both having the same composition and the same atomic arrangement, which substrates are directly bonded together and laminated,
wherein a front surface and a back surface of the laminated substrate are polar faces made of atoms of the same kind of A or B,
and a laminated interface is an unipolar antiphase boundary that is made of bonds of either atoms of B and A to each other and given a coherency in their crystal lattices.

A method for manufacturing a compound semiconductor laminated substrate, comprising:

preparing two single-crystalline compound semiconductor substrates in each of which one major surface is an A-face that is a polar face made of A atoms and another major surface is a B-face that is a polar face made of B atoms, each of which contains A and B as constituent elements, and both of which have the same composition and the same atomic arrangement;
and
directly affixing together the B-faces or the A-faces of the two compound semiconductor substrates in a state where specific crystal planes of both substrates are aligned, and thereby bonding the two compound semiconductor substrates to obtain a compound semiconductor laminated substrate in which a front surface and a back surface of the laminated substrate are polar faces made of atoms of the same kind of A or B and a laminated interface is a unipolar antiphase boundary that is made of bonds of either atoms of B and A to each other and given a coherency in their crystal lattices.

Dependencies are inferred from the claim text.

Compound semiconductor laminate substrate, method for manufacturing same, and semiconductor element

Life of this patent

Compound semiconductor laminate substrate, method for manufacturing same, and semiconductor element

Life of this patent

Abstract

Claims15