Y10T 83/0356
Serially
Y10T83/0356 (Serially) appears on 23 US grants and 6 published applications in this corpus.
Search patents in Y10T- Granted patents
- 23
- Published applications
- 6
- Assignees
- 16
- Inventors
- 33
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 0 |
| 2014 | 0 | 2 |
| 2015 | 2 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing crash pad of vehicle16 Jun 2026US 12,654,647 B2Bsp Co., Ltd.
- Unique sausage shapes and devices and methods for processing sausages8 Dec 2015US 9,204,664 B2
- Unique sausage shapes and devices and methods for processing sausages3 Feb 2015US 8,945,649 B2
- Unique sausage shapes and devices and methods for processing sausages19 Nov 2013US 8,584,565 B1
- Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method10 Aug 2010US 7,770,500 B2Mitsuboshi Diamond Industrial Co., Ltd.
- Method for manufacturing crash pad of vehicle30 Apr 2026US 2026/0116333 A1Bsp Co., Ltd.
- Unique sausage shapes and devices and methods for processing sausages18 Sep 2014US 2014/0272092 A1
- Unique sausage shapes and devices and methods for processing sausages18 Sep 2014US 2014/0273780 A1
- Substrate Dividing System, Substrate Manufacturing Equipment, Substrate Scribing Method and Substrate Dividing Method6 Dec 2007US 2007/0281444 A1Mitsuboshi Diamond Industrial Co., Ltd.
- Method of forming bridges in tamper-indicating closures13 Jan 2005US 2005/0005757 A1Owens-Illinois Closure Inc.
Most cited
By later US patents
- Apparatus for scribing and/or breaking semiconductor wafers34US 5,820,006 ADynatex International · 1998
- Blister packaging apparatus32US 4,750,318 AIdemitsu Petrochemical Co., Ltd. · 1988
- Glass cutting apparatus25US 4,939,968 A1990
- Apparatus for cutting sheet glass21US 4,187,755 A1980
- Self-compensating scoring head19US 4,098,155 AThe Fletcher-Terry Company · 1978