Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method
AssigneeMitsuboshi Diamond Industrial Co., Ltd.
InventorsYoshitaka Nishio, Yasutomo Okajima, Yukio Oshima, Hiroyuki Ohnari, Kazuhiro Yoshimoto
Life of this patent
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Abstract
A substrate cutting system which requires a small footprint area so as to be compact, and also which is capable of efficiently cutting a substrate is disclosed. A pair of substrate cutting devices are provided in a cutting device guide body 30 so as to be movable along a direction perpendicular to the moving direction of the clamp devices 50, the pair of substrate cutting devices cutting the mother substrate from each of the top surface and the bottom surface of the mother substrate which is clamped by the clamp devices 50.
Claims22
A substrate cutting system, comprising:
- a mounting base having a substrate supporting device for supporting a substrate;
- clamp devices for holding at least one part of a side edge of the substrate carried-in on the table, the clamp devices reciprocating the substrate along the (Y) direction, the (Y) direction being along one side of the mounting base;
- a pair of substrate cutting devices for cutting both sides of the substrate, respectively;
- and
- substrate cutting device guide bodies, fixed to the mounting base facing each other, for moving each of the substrate cutting devices on a top surface side and a bottom surface side of the substrate in the (X) direction perpendicular to the (Y) direction, the substrate being moved in the (Y) direction by the clamp devices,
- wherein
- the substrate supporting device further includes first substrate supporting units and second substrate supporting units, the first substrate supporting units and the second substrate supporting units are apart from each other in the (Y) direction and arranged with the substrate cutting devices therebetween, and
- the first substrate supporting units and the second substrate supporting units support the substrate such that the substrate which has been moved in the (Y) direction by the clamp devices is cut along the (X) direction and the (Y) direction by the substrate cutting devices.
Dependencies are inferred from the claim text.