Apparatus for scribing and/or breaking semiconductor wafers

Apparatus for automatic scribing and breaking of semiconductor wafers comprising:

• a. a base unit;
• b. a first table, mounted on the base unit for reciprocal movement along a first axis between first and second first table positions corresponding to a scribing station and a breaking station respectively;
• c. a second table mounted on the first table for reciprocal movement along a second axis perpendicular to said first axis, said second table having an aperture communicating between said first table and a third table;
• d. the third table mounted on the second table for angular movement about a third axis perpendicular to both said first and second axes, said third table having a central opening and adapted to hold a semiconductor wafer having upper and lower surfaces both while lines are being scribed on the upper wafer surface and while the wafer is being broken at said scribe lines;
• e. an impulse bar having an upper straight sharp edge mounted on the first table for reciprocal movement between first and second impulse bar positions parallel to said third axis, said first impulse bar position characterized by the upper edge of said impulse bar protruding through the central opening of said third table to a point above the upper surface of said third table, so that said upper edge will apply force along a line to the lower surface of a wafer held on the third table during both scribing and breaking;
• f. the breaking station including resistance means for resisting upward movement of a wafer held on the third table during application of force to the lower surface of the wafer by said impulse bar;
• g. the scribing station including a scribe tool having a cutting edge, said scribe tool mounted above said third table for movement between first and second scribe tool positions, the first said scribe tool position characterized by the scribe tool cutting edge positioned below the plane of the upper surface of a wafer held on the third table to apply a cutting force to the upper surface of said wafer when said first table is driven beneath said wafer along said first axis, and the second said scribe tool position characterized by the scribe tool cutting edge being positioned at a location where it will not touch the upper surface of the wafer when the wafer is urged upwardly from beneath by said impulse bar;
• h. a first drive motor to drive said first table along said first axis between said scribing and breaking stations, and during scribing of the wafer with the scribe tool;
• i. a second drive motor to drive said second table along said second axis in stepped increments so that spaced parallel scribe lines may be applied to said wafer;
• and,
• j. a third drive motor to drive said third table in rotation about said third axis for angular alignment of said wafer with said first and second axes.