Y10T 428/12882
Cu-base component alternative to ag-, au-, or ni-base component
Official title: Cu-base component alternative to Ag-, Au-, or Ni-base component
Y10T428/12882 (Cu-base component alternative to ag-, au-, or ni-base component) appears on 265 US grants and 185 published applications in this corpus.
Search patents in Y10T- Granted patents
- 265
- Published applications
- 185
- Assignees
- 203
- Inventors
- 653
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 6 | 0 |
| 1985 | 8 | 0 |
| 1986 | 6 | 0 |
| 1987 | 4 | 0 |
| 1988 | 6 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 7 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 5 | 0 |
| 1997 | 8 | 0 |
| 1998 | 6 | 0 |
| 1999 | 1 | 0 |
| 2000 | 8 | 0 |
| 2001 | 8 | 1 |
| 2002 | 4 | 6 |
| 2003 | 8 | 11 |
| 2004 | 8 | 14 |
| 2005 | 5 | 6 |
| 2006 | 10 | 8 |
| 2007 | 7 | 8 |
| 2008 | 6 | 5 |
| 2009 | 2 | 6 |
| 2010 | 3 | 8 |
| 2011 | 7 | 5 |
| 2012 | 4 | 7 |
| 2013 | 5 | 7 |
| 2014 | 11 | 6 |
| 2015 | 4 | 10 |
| 2016 | 5 | 11 |
| 2017 | 8 | 8 |
| 2018 | 12 | 9 |
| 2019 | 9 | 9 |
| 2020 | 5 | 7 |
| 2021 | 7 | 8 |
| 2022 | 6 | 7 |
| 2023 | 4 | 7 |
| 2024 | 10 | 5 |
| 2025 | 5 | 5 |
| 2026 | 4 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inlaid timepiece component and method for manufacturing the same18 Aug 2026US 12,710,728 B2Comadur SA
- Low-transmission-loss copper-based composite material and preparation method thereof, PCB, and electronic component30 Jun 2026US 12,668,890 B2Songshan Lake Materials Laboratory
- Method of manufacture of precious metal laminate5 May 2026US 12,618,135 B2Valaurum, Inc.
- Flexible copper-clad laminate and printed circuit made therefrom3 Mar 2026US 12,568,577 B2Dupont Electronics, Inc.
- Multi-colored decorative component and method30 Dec 2025US 12,508,834 B2Lacks Enterprises, Inc.
- Surface-treated copper foil16 Apr 2026US 2026/0107381 A1Dupont Electronics, Inc.
- Low-transmission-loss copper-based composite material and preparation method thereof, pcb, and electronic component20 Nov 2025US 2025/0354294 A1Songshan Lake Materials Laboratory
- Copper-coated steel wire30 Oct 2025US 2025/0336564 A1Sumitomo Electric Industries, Ltd.
- Method of manufacturing composite metal foil17 Jul 2025US 2025/0230569 A1Industrial Technology Research Institute
- Rolled material10 Jul 2025US 2025/0223670 A1Proterial, Ltd.
Most cited
By later US patents
- Electronic device using magnetic components385US 5,695,864 AInternational Business Machines Corporation · 1997
- Magnetoresistance effect element145US 5,549,978 AKabushiki Kaisha Toshiba · 1996
- Composite material having high thermal conductivity and process for fabricating same51US 5,783,316 AThe Regents of the University of California · 1998
- Heat wave-reflective or electrically conductive laminated structure50US 4,320,169 ATeijin Limited · 1982
- Copper foil composite including a release layer48US 6,346,335 B1Olin Corporation · 2002