Y10T 29/5317
Laminated device
Y10T29/5317 (Laminated device) appears on 283 US grants and 192 published applications in this corpus.
Search patents in Y10T- Granted patents
- 283
- Published applications
- 192
- Assignees
- 159
- Inventors
- 487
- Latest grant
- 5 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 6 | 0 |
| 1986 | 5 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 5 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 11 | 0 |
| 1995 | 4 | 0 |
| 1996 | 8 | 0 |
| 1997 | 6 | 0 |
| 1998 | 5 | 0 |
| 1999 | 6 | 0 |
| 2000 | 7 | 0 |
| 2001 | 2 | 4 |
| 2002 | 6 | 12 |
| 2003 | 6 | 12 |
| 2004 | 10 | 14 |
| 2005 | 5 | 9 |
| 2006 | 16 | 5 |
| 2007 | 13 | 13 |
| 2008 | 6 | 15 |
| 2009 | 8 | 9 |
| 2010 | 6 | 15 |
| 2011 | 13 | 15 |
| 2012 | 17 | 18 |
| 2013 | 11 | 8 |
| 2014 | 14 | 6 |
| 2015 | 5 | 6 |
| 2016 | 7 | 5 |
| 2017 | 3 | 1 |
| 2018 | 6 | 3 |
| 2019 | 4 | 2 |
| 2020 | 2 | 8 |
| 2021 | 4 | 5 |
| 2022 | 7 | 4 |
| 2023 | 5 | 1 |
| 2024 | 1 | 1 |
| 2025 | 3 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Bonding apparatus and bonding method5 Aug 2025US 12,381,083 B2Tokyo Electron Limited
- Method for producing lamination stacks and facility for performing the method29 Jul 2025US 12,374,969 B2Feintool International Holding AG
- Closed-cavity printed circuit board22 Apr 2025US 12,284,771 B2Skyworks Solutions, Inc.
- Signal delivery in stacked device30 Jan 2024US 11,887,969 B2
- Foil laminate intermediate and method of manufacturing25 Jul 2023US 11,710,886 B2Avery Dennison Retail Information Services LLC
- Method for Producing Lamination Stacks and Facility for Performing the Method23 Oct 2025US 2025/0330069 A1Feintool International Holding AG
- Apparatus for assembling lamellar packages for electrical use18 Jan 2024US 2024/0021361 A1Corrada S.p.A.
- Method of making a closed cavity printed circuit board with patterned laminate structure12 Oct 2023US 2023/0328901 A1Skyworks Solutions, Inc.
- Signal delivery in stacked device29 Dec 2022US 2022/0415855 A1Micron Technology, Inc.
- Circuit board1 Sep 2022US 2022/0279647 A1Avary Holding (Shenzhen) Co., Limited.
Most cited
By later US patents
- Extended use planar sensors401US 5,518,601 ACiba Corning Diagnostics Corp. · 1996
- Electrochemical sensors297US 5,401,376 ACiba Corning Diagnostics Corp. · 1995
- Signal delivery in stacked device289US 8,106,520 B2Micron Technology, Inc. · 2012
- RFID manufacturing concepts208US 6,451,154 B1Moore North America, Inc. · 2002
- Extended use planar sensors134US 5,387,329 ACiba Corning Diagnostics Corp. · 1995