Back to results
US 2022/0415855 A1Published application
Signal delivery in stacked device
AssigneeMicron Technology, Inc.
InventorsBrent Keeth, Mark Hiatt, Terry R. Lee, Mark Tuttle, Rahul Advani, John F. Schreck
Life of this patent
Estimating the term…
Abstract
Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.
Claims20
An apparatus comprising:
- a base;
- a first device, and a second device arranged in a stack with the first device and the base, the first device including at least one conductive path at least partly through the first device;
- an interposer located between and coupled to the first device and the second device;
- a first structure portion located on a first side of the first device;
- a second structure portion located on a second side of the first device;
- and
- conductive paths including a first portion of conductive paths going through vias of the first structure portion, and a second portion of conductive paths going through vias of the second structure portion.
4 more elements
An apparatus comprising:
- a base;
- a memory device over the base, the memory device including a first die and a second die;
- a second device over the memory device;
- an interposer located between and coupled to the memory device and the second device;
- a first structure portion located on a first side of the memory device;
- a second structure portion located on a second side of the memory device, such that the first die and the second die are between the first and second structure portions;
- and
- conductive paths including a first portion of conductive paths going through vias of the first structure portion, and a second portion of conductive paths going through vias of the second structure portion.
5 more elements
An apparatus comprising:
- a base;
- a first stack of dice and over the base, and a second stack of dice over the base;
- a processor over the first stack of dice and the second stack of dice;
- an interposer located between the second device and each of the first stack of dice and the second stack of dice;
- a first structure portion located on a side of the first stack of dice;
- a second structure portion located on a side of the second stack of dice, such that the first stack of dice and the second stack of dice are between the first and second structure portions;
- and
- conductive paths including a first portion of conductive paths going through vias of the first structure portion, and a second portion of conductive paths going through vias of the second structure portion.
5 more elements
Dependencies are inferred from the claim text.