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US 12,284,771 B2Granted
Closed-cavity printed circuit board
AssigneeSkyworks Solutions, Inc.
InventorKi Wook Lee
Life of this patent
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Abstract
A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.
Claims20
A closed-cavity printed circuit board comprising:
- a core layer with a cavity that extends entirely through the core layer from a top surface of the core layer to a bottom surface of the core layer with a first portion of the core layer forming a first side of the cavity and a second portion of the core layer forming a second side of the cavity;
- a first adhesive layer and a first patterned metal layer disposed over the top surface of the core layer to form a top of the cavity, and a second adhesive layer and a second patterned metal layer disposed over the bottom surface of the core layer to form a bottom of the cavity, the cavity being a closed cavity antenna filled with air;
- and
- vias through the first adhesive layer, the core layer, and the second adhesive layer to electrically connect portions of the first patterned metal layer with portions of the second patterned metal layer.
1 more element
Dependencies are inferred from the claim text.