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US 11,887,969 B2Granted
Signal delivery in stacked device
OwnerBrent Keeth, Mark Hiatt +4inventors
InventorsBrent Keeth, Mark Hiatt, Terry R. Lee, Mark Tuttle, Rahul Advani, John F. Schreck
Life of this patent
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Abstract
Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.
Claims7
An apparatus comprising:
- a base;
- a first device, and a second device arranged in a stack with the first device and the base, the first device including at least one conductive path at least partly through the first device, wherein the first device comprises a memory device;
- an interposer located between and coupled to the first device and the second device;
- a first structure portion located on a first side of the first device;
- a second structure portion located on a second side of the first device, wherein the first structure portion, the second structure portion, and the memory device have a same height;
- and
- conductive paths including a first portion of conductive paths going through vias of the first structure portion, and a second portion of conductive paths going through vias of the second structure portion.
4 more elements
Dependencies are inferred from the claim text.