Y10T 29/49213
Metal
Y10T29/49213 (Metal) appears on 407 US grants and 275 published applications in this corpus.
Search patents in Y10T- Granted patents
- 407
- Published applications
- 275
- Assignees
- 235
- Inventors
- 714
- Latest grant
- 5 Nov 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 4 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 4 | 0 |
| 1981 | 10 | 0 |
| 1982 | 3 | 0 |
| 1983 | 6 | 0 |
| 1984 | 5 | 0 |
| 1985 | 4 | 0 |
| 1986 | 8 | 0 |
| 1987 | 9 | 0 |
| 1988 | 5 | 0 |
| 1989 | 4 | 0 |
| 1990 | 6 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 6 | 0 |
| 1995 | 6 | 0 |
| 1996 | 11 | 0 |
| 1997 | 9 | 0 |
| 1998 | 9 | 0 |
| 1999 | 8 | 0 |
| 2000 | 7 | 0 |
| 2001 | 7 | 10 |
| 2002 | 12 | 17 |
| 2003 | 18 | 14 |
| 2004 | 17 | 16 |
| 2005 | 12 | 12 |
| 2006 | 11 | 5 |
| 2007 | 14 | 13 |
| 2008 | 19 | 31 |
| 2009 | 13 | 25 |
| 2010 | 16 | 21 |
| 2011 | 13 | 21 |
| 2012 | 14 | 20 |
| 2013 | 18 | 12 |
| 2014 | 18 | 28 |
| 2015 | 18 | 21 |
| 2016 | 22 | 5 |
| 2017 | 10 | 2 |
| 2018 | 5 | 0 |
| 2019 | 3 | 0 |
| 2020 | 1 | 1 |
| 2021 | 0 | 0 |
| 2022 | 1 | 1 |
| 2023 | 0 | 0 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Joining structure and joining method5 Nov 2024US 12,134,148 B2Panasonic Intellectual Property Management Co., Ltd.
- System and method for manufacturing flexible laminated circuit boards18 Jan 2022US 11,229,126 B2Duetto Integrated Systems, Inc.
- System and method for manufacturing flexible laminated circuit boards28 Apr 2020US 10,638,615 B2Duetto Integrated Systems, Inc.
- Wire crimping device24 Sep 2019US 10,424,891 B2Furukawa Automotive Systems Inc.
- Pane comprising an electrical connection element28 May 2019US 10,305,239 B2Saint-Gobain Glass France
- Joining structure and joining method2 Jun 2022US 2022/0168836 A1Panasonic Intellectual Property Management Co., Ltd.
- System and method for manufacturing flexible laminated circuit boards2 Jul 2020US 2020/0214146 A1Duetto Integrated Systems, Inc.
- Terminal connection strip, method of manufacturing crimp terminal, wire crimpting device, and method of crimping wire25 May 2017US 2017/0149192 A1Furukawa Automotive Systems Inc.
- High-speed connector inserts and cables11 May 2017US 2017/0133798 A1Apple Inc.
- Ceramic feedthrough brazed to an implantable medical device housing5 May 2016US 2016/0126713 A1Heraeus Deutschland GmbH & Co. KG
Most cited
By later US patents
- Method for coupling a power lead to a bond pad in an electronic module235US 5,544,412 AMotorola, Inc. · 1996
- Interconnector with contact pads having enhanced durability194US 5,810,607 AInternational Business Machines Corporation · 1998
- Resilient contact structures for interconnecting electronic devices194US 6,778,406 B2FormFactor, Inc. · 2004
- Method for fabricating an electronic device having solder joints186US 5,641,113 AOki Electronic Industry Co., Ltd. · 1997
- Resilient contact structures formed and then attached to a substrate169US 7,225,538 B2FormFactor, Inc. · 2007