Pane comprising an electrical connection element

A method for production of a pane with at least one electrical connection element, comprising:

• a) arranging and applying a leadfree solder material on contact surfaces of a connection element as a platelet with a fixed layer thickness, volume, and shape;
• b) applying an electrically conductive structure to a region of a substrate, the substrate having a first coefficient of thermal expansion from 8×10−6/° C. to 9×10-6/° C.;
• c) arranging the connection element with the solder material on the electrically conductive structure, the connection element having a second coefficient of thermal expansion from 10×10−6/° C. to 13×10−6/° C.,
• wherein the connection element contains at least 50 wt.-% to 89.5 wt.-% iron, 16 wt.-% to 20 wt.-% chromium, and one or more selected form the group of carbon, nickel, manganese, molybdenum, and titanium, and
• wherein the difference between the first coefficient of thermal expansion of the substrate and the second coefficient of thermal expansion of the connection element is less than 5×10−6/° C., and
• d) soldering the connection element to the electrically conductive structure, wherein
• a cavity that is delimited by the electrically conductive structure, the transition regions, and the bridge region is completely or not completely filled with solder material,
• the connection element contains a first and a second foot region, a first and a second transition region, and a bridge region between the first and the second transition region, wherein the first and foot region, the first and second transition region and the bridge region have a same width,
• a first and a second contact surface are located on a bottom of the first and the second foot region,
• the first and second contact surface and surfaces of the first and the second transition region facing the substrate are directly connected to the electrically conductive structure by the layer of solder material, wherein the surface of the first transition region facing the substrate directly adjoins the first contact surface and the surface of the second transition region facing the substrate directly adjoins the second contact surface,
• an angle between a surface of the substrate and each tangent plane of the surfaces of the first and the second transition regions facing the substrate is greater than 0° and less than 90°.

A method, comprising:

• using a pane with at least one electrical connection element, for vehicles with electrically conductive structures, preferably with heating conductors and/or antenna conductors, the pane including
• a substrate for applying an electrically conductive structure on a region of the substrate, the substrate having a first coefficient of thermal expansion from 8×10−6/° C. to 9×10−6/° C.,
• a layer of a leadfree solder material on a region of the electrically conductive structure, and
• a connection element on the layer of solder material, wherein
• the connection element has a second coefficient of thermal expansion from 10×10−6/° to 13×10−6/° C.,
• the connection element contains at least 50 wt.-% to 89.5 wt.-% iron, 16 wt.-% to 20 wt.-% chromium, and one or more selected form the group of carbon, nickel, manganese, molybdenum, and titanium,
• the difference between the first coefficient of thermal expansion of the substrate and the second coefficient of thermal expansion of the connection element is less than 5×10−6/° C.,
• the connection element contains a first and a second foot region, a first and a second transition region, and a bridge region between the first and the second transition region, wherein the first and second foot region, the first and second transition region and the bridge region have a same width,
• a first and a second contact surface are located on a bottom of the first and the second foot region,
• the first and second contact surface and surfaces of the first and the second transition region facing the substrate are directly connected to the electrically conductive structure by the layer of solder material, wherein the surface of the first transition region facing the substrate directly adjoins the first contact surface and the surface of the second transition region facing the substrate directly adjoins the second contact surface,
• an angle between a surface of the substrate and each tangent plane of the surfaces of the first and the second transition regions facing the substrate is greater than 0° and less than 90° , and
• a cavity that is delimited by the electrically conductive structure, the transition regions, and the bridge region is completely or not completely filled with solder material.