Y10T 29/49146
With encapsulating
Official title: with encapsulating, e.g., potting, etc.
Y10T29/49146 (With encapsulating) appears on 1,587 US grants and 1,151 published applications in this corpus.
Search patents in Y10T- Granted patents
- 1,587
- Published applications
- 1,151
- Assignees
- 620
- Inventors
- 2,586
- Latest grant
- 9 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 5 | 0 |
| 1978 | 4 | 0 |
| 1979 | 4 | 0 |
| 1980 | 9 | 0 |
| 1981 | 4 | 0 |
| 1982 | 0 | 0 |
| 1983 | 5 | 0 |
| 1984 | 7 | 0 |
| 1985 | 5 | 0 |
| 1986 | 5 | 0 |
| 1987 | 9 | 0 |
| 1988 | 14 | 0 |
| 1989 | 27 | 0 |
| 1990 | 13 | 0 |
| 1991 | 10 | 0 |
| 1992 | 11 | 0 |
| 1993 | 23 | 0 |
| 1994 | 29 | 0 |
| 1995 | 25 | 0 |
| 1996 | 36 | 0 |
| 1997 | 38 | 0 |
| 1998 | 42 | 0 |
| 1999 | 36 | 0 |
| 2000 | 46 | 0 |
| 2001 | 58 | 28 |
| 2002 | 74 | 114 |
| 2003 | 89 | 89 |
| 2004 | 86 | 84 |
| 2005 | 66 | 66 |
| 2006 | 70 | 78 |
| 2007 | 56 | 51 |
| 2008 | 49 | 78 |
| 2009 | 38 | 89 |
| 2010 | 59 | 84 |
| 2011 | 78 | 63 |
| 2012 | 86 | 76 |
| 2013 | 70 | 62 |
| 2014 | 81 | 59 |
| 2015 | 59 | 71 |
| 2016 | 43 | 10 |
| 2017 | 35 | 13 |
| 2018 | 24 | 13 |
| 2019 | 22 | 9 |
| 2020 | 11 | 8 |
| 2021 | 6 | 2 |
| 2022 | 10 | 3 |
| 2023 | 2 | 1 |
| 2024 | 4 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Manufacturing method of package structure9 Sep 2025US 12,414,243 B2Unimicron Technology Corp.
- Feedthrough assembly with feature for controlling component position22 Oct 2024US 12,121,735 B2Medtronic, Inc.
- Panel molded electronic assemblies with multi-surface conductive contacts17 Sep 2024US 12,096,549 B1Vicor Corporation
- Manufacturing method of package structure6 Feb 2024US 11,895,780 B2Unimicron Technology Corp.
- Managed electrical connectivity systems2 Jan 2024US 11,862,912 B2CommScope Technologies LLC
- Managed electrical connectivity systems13 Jul 2023US 2023/0223726 A1CommScope Technologies LLC
- Manufacturing method of package structure24 Nov 2022US 2022/0375919 A1Unimicron Technology Corp.
- Method for producing a printed circuit board22 Sep 2022US 2022/0304153 A1NextGin Technology BV
- Feedthrough assembly with feature for controlling component position21 Apr 2022US 2022/0118263 A1Medtronic, Inc.
- Managed electrical connectivity systems30 Sep 2021US 2021/0305760 A1CommScope Technologies LLC
Most cited
By later US patents
- Tamper respondent system1,284US 7,787,256 B2Gore Enterprise Holdings, Inc. · 2010
- Method and apparatus for surgical navigation791US 7,366,562 B2Medtronic Navigation, Inc. · 2008
- Method and apparatus for surgical navigation686US 7,751,865 B2Medtronic Navigation, Inc. · 2010
- Semiconductor device in a resin package housed in a frame having high thermal conductivity660US 5,625,222 AFujitsu Limited · 1997
- Thermometer having molded probe component478US 8,496,377 B2Covidien LP · 2013