Y10T 29/49131
By utilizing optical sighting device
Official title: by utilizing optical sighting device
Y10T29/49131 (By utilizing optical sighting device) appears on 717 US grants and 531 published applications in this corpus.
Search patents in Y10T- Granted patents
- 717
- Published applications
- 531
- Assignees
- 284
- Inventors
- 1,221
- Latest grant
- 19 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 9 | 0 |
| 1989 | 6 | 0 |
| 1990 | 7 | 0 |
| 1991 | 12 | 0 |
| 1992 | 10 | 0 |
| 1993 | 10 | 0 |
| 1994 | 5 | 0 |
| 1995 | 8 | 0 |
| 1996 | 8 | 0 |
| 1997 | 9 | 0 |
| 1998 | 12 | 0 |
| 1999 | 20 | 0 |
| 2000 | 23 | 0 |
| 2001 | 31 | 25 |
| 2002 | 31 | 51 |
| 2003 | 41 | 32 |
| 2004 | 38 | 56 |
| 2005 | 48 | 57 |
| 2006 | 52 | 41 |
| 2007 | 40 | 30 |
| 2008 | 21 | 24 |
| 2009 | 42 | 37 |
| 2010 | 29 | 32 |
| 2011 | 31 | 20 |
| 2012 | 32 | 20 |
| 2013 | 25 | 10 |
| 2014 | 17 | 7 |
| 2015 | 15 | 50 |
| 2016 | 5 | 4 |
| 2017 | 16 | 7 |
| 2018 | 16 | 7 |
| 2019 | 8 | 4 |
| 2020 | 8 | 4 |
| 2021 | 6 | 5 |
| 2022 | 4 | 7 |
| 2023 | 8 | 1 |
| 2024 | 0 | 0 |
| 2025 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Display panel bonding device and correction apparatus19 Aug 2025US 12,396,147 B2KunShan Go-Visionox Opto-Electronics Co., Ltd
- Component mounting machine22 Apr 2025US 12,284,765 B2Fuji Corporation
- Method of controlling the placement of micro-objects on a micro-assembler3 Oct 2023US 11,772,964 B2Xerox Corporation
- Component mounting device5 Sep 2023US 11,751,371 B2Fuji Corporation
- Wafer bonding method and wafer bonding apparatus8 Aug 2023US 11,721,662 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic module13 Jul 2023US 2023/0225055 A1Imberatek, LLC
- Component mounting machine29 Sep 2022US 2022/0312659 A1Fuji Corporation
- Display panel bonding device and correction apparatus and method thereof21 Jul 2022US 2022/0232748 A1KunShan Go-Visionox Opto-Electronics Co., Ltd
- Method of controlling the placement of micro-objects on a micro-assembler19 May 2022US 2022/0153575 A1Palo Alto Research Center Incorporated
- Method of controlling the placement of micro-objects on a micro-assembler19 May 2022US 2022/0153576 A1Palo Alto Research Center Incorporated
Most cited
By later US patents
- Assembling a stacked die package165US 6,212,767 B1Micron Technology, Inc. · 2001
- Method and apparatus for chip placement150US 4,980,971 AAT&T Bell Laboratories · 1991
- Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames140US 5,113,565 AInternational Business Machines Corporation · 1992
- Package structure fabrication method124US 7,934,313 B1Siliconware Precision Industries Co., Ltd. · 2011
- Computer aided connector assembly method and apparatus122US 4,727,637 AThe Boeing Company · 1988