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US 6,212,767 B1Granted
Assembling a stacked die package
AssigneeMicron Technology, Inc.
InventorPatrick W. Tandy
Life of this patent
Estimating the term…
Abstract
A technique for assembling a multi-chip module does not necessitate more than one pass through a die attach machine. The technique involves attaching a smaller die to a larger die without using a die attach machine. The larger die may be attached to a support structure using a die attach machine. In some embodiments, the larger die is affixed to the support structure first and in other embodiments, the smaller die is affixed to the larger die first.
Claims19
A method of assembling multi-chip modules comprising:
- using a die attach machine to attach a first, relatively larger die to a support structure;
- and
- affixing a second, relatively smaller die to a larger die without using a die attach machine.
A method of assembling multi-chip modules comprising:
- locating a first, relatively larger die on a wafer tape;
- attaching a second, relatively smaller die to a larger die;
- and
- die attaching the attached dice to a support structure.
1 more element
A method of assembling multi-chip modules comprising:
- locating a larger die on a wafer tape;
- attaching a smaller die next to a larger die on said wafer tape;
- mounting a larger die to a support structure;
- mounting said smaller die on said larger die;
- and
- securing said smaller die and said larger die on said support structure.
3 more elements
Dependencies are inferred from the claim text.