Y10T 225/379
Breaking tool intermediate spaced work supports
Y10T225/379 (Breaking tool intermediate spaced work supports) appears on 167 US grants and 80 published applications in this corpus.
Search patents in Y10T- Granted patents
- 167
- Published applications
- 80
- Assignees
- 107
- Inventors
- 229
- Latest grant
- 18 May 2021
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 5 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 10 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 5 | 0 |
| 1999 | 6 | 0 |
| 2000 | 1 | 0 |
| 2001 | 9 | 4 |
| 2002 | 7 | 6 |
| 2003 | 8 | 9 |
| 2004 | 8 | 9 |
| 2005 | 7 | 8 |
| 2006 | 8 | 5 |
| 2007 | 5 | 4 |
| 2008 | 2 | 4 |
| 2009 | 0 | 3 |
| 2010 | 4 | 8 |
| 2011 | 6 | 3 |
| 2012 | 4 | 4 |
| 2013 | 6 | 2 |
| 2014 | 2 | 3 |
| 2015 | 4 | 1 |
| 2016 | 0 | 1 |
| 2017 | 1 | 2 |
| 2018 | 1 | 2 |
| 2019 | 3 | 1 |
| 2020 | 3 | 1 |
| 2021 | 1 | 0 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Device for releasing catch between precut substrates, robot, and robot system therefor18 May 2021US 11,007,663 B2Fanuc Corporation
- Method of separating a back layer on a singulated semiconductor wafer attached to carrier substrate8 Sep 2020US 10,770,350 B2Semiconductor Components Industries, LLC
- Apparatus and method for manufacturing field-pole magnet10 Mar 2020US 10,583,579 B2Nissan Motor Co., Ltd.
- Method of separating a back layer on a singulated semiconductor wafer attached to carrier substrates4 Feb 2020US 10,553,491 B2Semiconductor Components Industries, LLC
- Precast hole scab removing device17 Dec 2019US 10,507,522 B2CITIC Dicastal Co., Ltd.
- Method of singulating semiconductor wafer having a plurality of die and a back layer disposed along a major surface16 Apr 2020US 2020/0118878 A1Semiconductor Components Industries, LLC
- Method of singulating semiconductor wafer having a plurality of die and a back layer disposed along a major surface11 Jul 2019US 2019/0214301 A1Semiconductor Components Industries, LLC
- Method of singulating semiconductor wafer having a plurality of die and a back layer disposed along a major surface20 Sep 2018US 2018/0269104 A1Semiconductor Components Industries, LLC
- Method and device for breaking out a planar workpiece from a material sheet21 Jun 2018US 2018/0169884 A1Boxplan GmbH & Co.KG
- Precast hole scab removing device7 Dec 2017US 2017/0348769 A1CITIC Dicastal Co., Ltd.
Most cited
By later US patents
- Substrate cleaving tool and method70US 6,221,740 B1Silicon Genesis Corporation · 2001
- Method for separating a pane of brittle material from a moving ribbon of material68US 8,292,141 B2Corning Incorporated · 2012
- Method and apparatus for breaking an optical fiber62US 4,662,710 AAMP Incorporated · 1987
- Lottery ticket dispenser for break-resistant web material60US 4,094,451 AGranite State Machine Co., Inc. · 1978
- Apparatus for cutting sheet material60US 4,488,466 ASeal Tech Corp. · 1984