Y10T 225/371
Movable breaking tool
Y10T225/371 (Movable breaking tool) appears on 560 US grants and 250 published applications in this corpus.
Search patents in Y10T- Granted patents
- 560
- Published applications
- 250
- Assignees
- 329
- Inventors
- 794
- Latest grant
- 24 Dec 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 14 | 0 |
| 1978 | 15 | 0 |
| 1979 | 18 | 0 |
| 1980 | 14 | 0 |
| 1981 | 14 | 0 |
| 1982 | 11 | 0 |
| 1983 | 7 | 0 |
| 1984 | 13 | 0 |
| 1985 | 10 | 0 |
| 1986 | 10 | 0 |
| 1987 | 12 | 0 |
| 1988 | 12 | 0 |
| 1989 | 14 | 0 |
| 1990 | 12 | 0 |
| 1991 | 11 | 0 |
| 1992 | 24 | 0 |
| 1993 | 11 | 0 |
| 1994 | 12 | 0 |
| 1995 | 9 | 0 |
| 1996 | 10 | 0 |
| 1997 | 9 | 0 |
| 1998 | 17 | 0 |
| 1999 | 14 | 0 |
| 2000 | 6 | 0 |
| 2001 | 16 | 6 |
| 2002 | 18 | 24 |
| 2003 | 22 | 23 |
| 2004 | 22 | 26 |
| 2005 | 16 | 21 |
| 2006 | 21 | 16 |
| 2007 | 9 | 9 |
| 2008 | 8 | 11 |
| 2009 | 6 | 12 |
| 2010 | 9 | 13 |
| 2011 | 13 | 14 |
| 2012 | 9 | 13 |
| 2013 | 15 | 18 |
| 2014 | 15 | 20 |
| 2015 | 10 | 10 |
| 2016 | 12 | 3 |
| 2017 | 9 | 4 |
| 2018 | 5 | 2 |
| 2019 | 4 | 2 |
| 2020 | 4 | 1 |
| 2021 | 2 | 1 |
| 2022 | 1 | 1 |
| 2023 | 1 | 0 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Container top punch apparatus24 Dec 2024US 12,172,286 B1
- Self-powered concrete/steel structure disassembling apparatus21 Feb 2023US 11,583,867 B2
- Pill cutter9 Aug 2022US 11,406,566 B2E-Link Plastic & Metal Industrial Co., Ltd.
- Device for releasing catch between precut substrates, robot, and robot system therefor18 May 2021US 11,007,663 B2Fanuc Corporation
- Residual material removing device, method and, system2 Feb 2021US 10,906,833 B2Chongqing Hkc Optoelectronics Technology Co., Ltd.
- Pill cutter6 Jan 2022US 2022/0000719 A1E-Link Plastic & Metal Industrial Co., Ltd.
- Self-powered concrete/steel structure disassembling apparatus16 Dec 2021US 2021/0387204 A1
- Method of singulating semiconductor wafer having a plurality of die and a back layer disposed along a major surface16 Apr 2020US 2020/0118878 A1Semiconductor Components Industries, LLC
- Shorts removal device, method and system17 Oct 2019US 2019/0315012 A1Chongqing Hkc Optoelectronics Technology Co., Ltd.
- Method of singulating semiconductor wafer having a plurality of die and a back layer disposed along a major surface11 Jul 2019US 2019/0214301 A1Semiconductor Components Industries, LLC
Most cited
By later US patents
- Method and apparatus for replacing buried pipe209US 4,507,019 AExpand-A-Line, Incorporated · 1985
- Specialized tool adapted for a process for manufacture and interconnection between adjoining printed wiring boards178US 6,464,121 B2Xerox Corporation · 2002
- Method of making a slitted or particulate absorbent material106US 6,203,654 B1The Procter & Gamble Company · 2001
- Lottery ticket dispenser97US 5,836,498 AInterlott Technologies, Inc. · 1998
- Method of replacing mains81US 4,738,565 ABritish Gas Corporation · 1988