Shorts removal device, method and system
AssigneesHkc Corporation Limited, Chongqing Hkc Optoelectronics Technology Co., Ltd.
InventorChunchin HUANG
Life of this patent
Estimating the term…
Abstract
The present application provides a residual material removing device, method and system, in which the residual material removing device includes: a loading platform configured to support a material to be cut; a fixing plate abutting against an upper surface of the material to be cut is configured to fix the material to be cut, and one end of the fixing plate is in contact with a residual material in the material to be cut; a first pressing portion in contact with one end of the fixing plate is configured to apply pressing force to one end of the fixing plate to separate the residual material from the material to be cut under the action of the pressing force.
Claims21
1-20. (canceled)
A residual material removing device, comprising:
- a loading platform configured to support a material to be cut;
- a fixing plate, in tight contact with an upper surface of the material to be cut, and configured to fix the material to be cut, wherein one end of the fixing plate is in contact with the residual material in the material to be cut;
- and
- a first pressing portion, in contact with one end of the fixing plate, and configured to apply pressing force to the one end of the fixing plate to separate the residual material from the material to be cut under the action of the pressing force.
A residual material removing method as implemented via a residual material removing device, the residual material removing device comprises a loading platform, a fixing plate, a first pressing portion, and a conveying portion, and the method comprises:
- controlling the conveying portion to convey the material to be cut to a position of the loading platform right beneath the fixing plate;
- controlling the fixing plate to tightly contact with an upper surface of the material to be cut to fix the material to be cut, and to contact one end of the fixing plate with the residual material in the material to be cut;
- and
- controlling the first pressing portion to apply pressing force to one end of the fixing plate to separate the residual material from the material to be cut under the action of the pressing force.
A residual material removing system as implemented via a residual material removing device, the residual material removing device comprises a loading platform, a fixing plate, a first pressing portion, and a conveying portion, and the residual material removing systems comprises:
- a processor, a communication interface, a memory and a bus;
- wherein communication of the processor, the communication interface and the memory with one another is achieved via the bus;
- the communication interface is configured to communicate with an external device.
- the processor is configured to execute a program;
- the memory is configured to store the program;
- the processor comprises:
- a conveying portion controller configured to control the conveying portion to convey the material to be cut to a position of the loading platform right beneath the fixing plate;
- a fixing plate controller configured to control the fixing plate to tightly contact with an upper surface of the material to be cut to fix the material to be cut, and to contact one end of the fixing plate with the residual material in the material to be cut;
- and
- a first pressing portion controller configured to control the first pressing portion to apply pressing force to one end of the fixing plate to separate the residual material from the material to be cut under the action of the pressing force.
Dependencies are inferred from the claim text.