Y10S 83/906
Chip making
Y10S83/906 (Chip making) appears on 23 US grants and 6 published applications in this corpus.
Search patents in Y10S- Granted patents
- 23
- Published applications
- 6
- Assignees
- 18
- Inventors
- 40
- Latest grant
- 28 Nov 2006
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 1 |
| 2003 | 2 | 3 |
| 2004 | 1 | 0 |
| 2005 | 2 | 2 |
| 2006 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Wire chopper module for EDM system28 Nov 2006US 7,140,285 B2Florian Precision, LLC
- Method and apparatus for cutting semiconductor wafers28 Mar 2006US 7,018,270 B2Micron Technology, Inc.
- Wire chopper module for EDM system27 Sep 2005US 6,948,413 B2Florian Precision, LLC
- Method and apparatus for cutting semiconductor wafers6 Sep 2005US 6,939,199 B2Micron Technology, Inc.
- Knife arrangement for a granulator for granulating plastic ropes24 Aug 2004US 6,779,429 B2Reiter Automatik GmbH
- Method and apparatus for cutting semiconductor wafers8 Dec 2005US 2005/0268763 A1Micron Technology, Inc.
- Wire chopper module for EDM system1 Dec 2005US 2005/0263635 A1Florian Precision, LLC
- Wire chopper module for EDM system6 Nov 2003US 2003/0205121 A1Florian Precision, LLC
- Method and apparatus for cutting semiconductor wafers30 Oct 2003US 2003/0203538 A1Micron Technology, Inc.
- Method for cutting semiconductor wafers27 Mar 2003US 2003/0060022 A1Micron Technology, Inc.
Most cited
By later US patents
- Method for cutting semiconductor wafers106US 6,576,531 B2Micron Technology, Inc. · 2003
- Method for dicing of micro devices44US 6,291,317 B1Xerox Corporation · 2001
- Multi-bladed disc cutter for underwater pelletizers23US 4,728,275 AArco Chemical Company · 1988
- Pressure-sensitive adhesive tapes for electronics applications23US 5,508,107 AMinnesota Mining and Manufacturing Company · 1996
- Process and apparatus for making discrete type substrates by re-slicing a wafer18US 5,240,882 ANaoetsu Electronics Company · 1993