Pressure-sensitive adhesive tapes for electronics applications
AssigneeMinnesota Mining and Manufacturing Company
InventorsGustav Gutman, Steven D. Yau
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Abstract
A water-resistant, anti-static pressure-sensitive adhesive tape suitable for use as a wafer dicing tape comprising a flexible substrate having opposing surfaces, at least one surface bearing thereon a removable, aziridine-crosslinked microparticulate adhesive comprised of microparticles having a surface bearing thereon an ionic conductive material formed from a polymer electrolyte base polymer, and at least one ionic salt selected from the group consisting of salts of alkali metals and salts of alkaline earth metals, wherein said microparticles have an average diameter of at least about 1 micrometer, said adhesive having an adhesion to steel of from about 0.5 Newtons/100 mm (N/100 mm) to about 10 N/100 mm.
Claims14
A water-resistant, anti-static pressure-sensitive adhesive tape suitable for use as a wafer dicing tape comprising a flexible substrate having opposing surfaces, at least one surface bearing thereon a removable, aziridine-crosslinked microparticulate adhesive comprised of microparticles having a surface bearing thereon an ionic conductive material formed from a polymer electrolyte base polymer, and at least one ionic salt selected from the group consisting of salts of alkali metals and salts of alkaline earth metals, wherein said microparticles have an average diameter of at least about 1 micrometer, said adhesive having an adhesion to steel of from about 0.5Newtons/100 mm (N/100 mm) to about 10 N/100 mm.
Dependencies are inferred from the claim text.