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US 6,291,317 B1Granted
Method for dicing of micro devices
AssigneeXerox Corporation
InventorsNicholas J. Salatino, John C. Ackerman
Life of this patent
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Abstract
A method for dicing small devices including MEMS, ink jet printheads, lasers etc. The method comprises making a first pass cut into a substrate with a blade of narrow kerf and having long wear characteristics. This first pass cut is then followed with a polishing blade of wider kerf having desirable smooth cutting qualities.
Claims29
A method for micro-machining ink jet printheads on a substrate, comprising:
- sawing the substrate with a first saw blade to yield a first pass kerf on the substrate, the first pass kerf having a first kerf width;
- and,
- polishing the first pass kerf with a second saw blade to yield a second pass kerf from the first pass kerf, the second pass kerf having a second kerf width, where the second kerf width is wider than the first kerf width.
A method for dicing ink jet printheads from a substrate having a front side and a back side, comprising:
- sawing the substrate with a first saw blade to yield a first pass kerf on the front side of the substrate, the first pass kerf having a first kerf width;
- polishing the first pass kerf with a second saw blade to yield a second pass kerf from the first pass kerf, the second pass kerf having a second pass kerf width, where the second pass kerf width is wider than the first pass kerf width;
- and,
- sawing the substrate from the back side of the substrate in alignment with the second pass kerf and intersecting the second pass kerf.
1 more element
A method for micro-machining devices on a substrate, comprising:
- sawing the substrate with a first saw blade to yield a first pass kerf on the substrate, the first pass kerf having a first kerf width;
- and,
- polishing the first pass kerf with a second saw blade to yield a second pass kerf from the first pass kerf, the second pass kerf having a second kerf width, where the second kerf width is wider than the first kerf width.
Dependencies are inferred from the claim text.