Y10S 451/914
Supporting, positioning, or feeding work
Y10S451/914 (Supporting, positioning, or feeding work) appears on 10 US grants and 7 published applications in this corpus.
Search patents in Y10S- Granted patents
- 10
- Published applications
- 7
- Assignees
- 6
- Inventors
- 25
- Latest grant
- 12 Jul 2011
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 1 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 1 | 2 |
| 2008 | 0 | 1 |
| 2009 | 4 | 1 |
| 2010 | 0 | 0 |
| 2011 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Substrate polishing apparatus and method12 Jul 2011US 7,976,362 B2Ebara Corporation
- Automated insulation milling machine8 Dec 2009US 7,628,677 B1
- Substrate polishing apparatus and method8 Sep 2009US 7,585,205 B2Ebara Corporation
- Method for determining position of semiconductor wafer, and apparatus using the same14 Apr 2009US 7,519,448 B2Nitto Denko Corporation
- Grinding jig set and grinding method31 Mar 2009US 7,510,461 B2NGK Insulators, Ltd.
- Substrate polishing apparatus and method29 Sep 2011US 2011/0237163 A1
- Substrate polishing apparatus and method26 Nov 2009US 2009/0291624 A1Ebara Corporation
- Substrate polishing apparatus and method10 Apr 2008US 2008/0085658 A1Ebara Corporation
- Method for determining position of semiconductor wafer, and apparatus using the same21 Jun 2007US 2007/0139642 A1Nitto Denko Corporation
- Grinding jig set and grinding method19 Apr 2007US 2007/0087666 A1NGK Insulators, Ltd.
Most cited
By later US patents
- Polishing apparatus having robotic transport apparatus18US 5,893,794 AEbara Corporation · 1999
- Guide ring removal device15US 6,726,554 B1Nanya Technology Corporation · 2004
- Semiconductor polishing pad alignment device for a polishing apparatus and method of use12US 6,514,123 B1Agere Systems Inc. · 2003
- Robotic transport apparatus6US 5,961,380 A1999
- Method for determining position of semiconductor wafer, and apparatus using the same5US 7,519,448 B2Nitto Denko Corporation · 2009