Semiconductor polishing pad alignment device for a polishing apparatus and method of use
AssigneeAgere Systems Inc.
InventorsAnnette M. Crevasse, William G. Easter, John A. Maze, Frank Miceli
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Abstract
The present invention provides a polishing pad alignment device having an alignment member positionable against a side wall of a platen. The height of the alignment member is sufficient to extend above a top surface of the platen when positioned against the wall of the platen. In one embodiment, the alignment member is an arcuate member having an arc substantially equal to an arc of the platen. In another embodiment, the alignment member is removably attachable to the wall of the platen and the polishing pad alignment member further includes an attachment device configured to attach the alignment member to the platen.
Claims13
A polishing pad alignment device, comprising:
- an alignment member removably positionable against a side wall of a platen, the alignment member having a height sufficient to extend above a top surface of the platen when positioned against the wall of the platen;
- and
- an attachment device configured to attach the alignment member to the platen, wherein the attaclunent device is a pin coupled to a wall of the polishing pad alignment member, the pin being configured to be cooperatively received in a corresponding pin receptacle in the wall of the platen.
A method of alignment a polishing pad on a platen, comprising:
- positioning an alignment member against a side wall of a platen, the alignment member having a height sufficient to extend above a top surface of the platen when positioned against the wall of the platen;
- positioning an edge of the polishing pad against the alignment member;
- and
- positioning the polishing pad on the platen as the edge is positioned against the alignment member.
A polishing pad alignment device, comprising:
- an alignment member removably positionable against a side wall of a platen, the alignment member having a height sufficient to extend above a top surface of the platen when positioned against the wall of the platen;
- and
- an attachment device configured to attach the alignment member to the platen, wherein the attachment device is a magnet that magnetically retains the polishing pad alignment device against the wall of the platen.
Dependencies are inferred from the claim text.