Y10S 428/901
Printed circuit
Y10S428/901 (Printed circuit) appears on 2,510 US grants and 438 published applications in this corpus.
Search patents in Y10S- Granted patents
- 2,510
- Published applications
- 438
- Assignees
- 758
- Inventors
- 4,308
- Latest grant
- 29 Mar 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 27 | 0 |
| 1977 | 17 | 0 |
| 1978 | 18 | 0 |
| 1979 | 16 | 0 |
| 1980 | 17 | 0 |
| 1981 | 28 | 0 |
| 1982 | 28 | 0 |
| 1983 | 36 | 0 |
| 1984 | 28 | 0 |
| 1985 | 39 | 0 |
| 1986 | 60 | 0 |
| 1987 | 76 | 0 |
| 1988 | 97 | 0 |
| 1989 | 104 | 0 |
| 1990 | 123 | 0 |
| 1991 | 138 | 0 |
| 1992 | 120 | 0 |
| 1993 | 105 | 0 |
| 1994 | 112 | 0 |
| 1995 | 80 | 0 |
| 1996 | 97 | 0 |
| 1997 | 107 | 0 |
| 1998 | 129 | 0 |
| 1999 | 129 | 0 |
| 2000 | 116 | 0 |
| 2001 | 117 | 39 |
| 2002 | 111 | 90 |
| 2003 | 95 | 68 |
| 2004 | 84 | 74 |
| 2005 | 52 | 43 |
| 2006 | 41 | 23 |
| 2007 | 40 | 28 |
| 2008 | 21 | 12 |
| 2009 | 12 | 24 |
| 2010 | 28 | 11 |
| 2011 | 20 | 12 |
| 2012 | 25 | 5 |
| 2013 | 1 | 5 |
| 2014 | 6 | 3 |
| 2015 | 7 | 0 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
| 2018 | 1 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Multilayer laminate and method for producing multilayer printed wiring board using same29 Mar 2022US 11,285,700 B2Mitsui Mining & Smelting Co., Ltd.
- Machine direction oriented polymeric films and methods of making the same26 Jun 2018US RE46,911 E1Avery Dennison Corporation
- Liner with electrical pathways24 Jan 2017US 9,551,524 B2Whirlpool Corporation
- Adhesion promotion in printed circuit boards26 May 2015US 9,040,117 B2Enthone Inc.
- Substrate for printed wiring and resin composition used therefor12 May 2015US 9,028,949 B2Jsr Corporation
- Multilayer laminate and method for producing multilayer printed wiring board using same11 Apr 2019US 2019/0110364 A1Mitsui Mining & Smelting Co., Ltd.
- Multilayer ceramic substrate and method for producing the same11 Dec 2014US 2014/0361470 A1Murata Manufacturing Co., Ltd.
- Liner with electrical pathways7 Aug 2014US 2014/0217878 A1Whirlpool Corporation
- Process for Production of Glass Fiber Fabric Having Silica Microparticles Adhered Thereon, Glass Fiber Fabric Having Silica Microparticles Adhered Thereon, and Fiber-Reinforced Molded Resin Article30 Jan 2014US 2014/0026620 A1Nitto Boseki Co., Ltd.
- Resin composition for insulation film19 Sep 2013US 2013/0245161 A1Elite Material Co., Ltd.
Most cited
By later US patents
- Oximeter sensor assembly with integral cable and method of forming the same965US 5,041,187 AThor Technology Corporation · 1991
- Thin film electrical component781US 5,108,819 AEli Lilly and Company · 1992
- Alumina sintered body412US 5,279,886 ANgk Spark Plug Co., Ltd. · 1994
- Method of making a thin film electrical component396US 5,403,700 AEli Lilly and Company · 1995
- Method for making an electronic module391US 5,745,984 AMartin Marietta Corporation · 1998