Substrate for printed wiring and resin composition used therefor
AssigneeJsr Corporation
InventorsMotoki Okaniwa, Toshimitsu Kikuchi, Takaaki Uno, Takashi Okada
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Abstract
There are provided a substrate for printed wiring excellent in light transmission property, heat resistance, mechanical strength and resistance to thermal coloration; a printed wiring laminate; and a resin composition used to produce the substrate and the laminate. The substrate for printed wiring comprises an aromatic polyether-typed polymer having a glass transition temperature, as measured by differential scanning calorimetry (DSC, heating rate: 20° C./minute), of from 230° C. to 350° C.
Claims13
A printed wiring laminate comprising a transparent printed wiring substrate and a wiring portion provided on the transparent printed wiring substrate, wherein the transparent printed wiring substrate comprises an aromatic polyether-typed polymer having a glass transition temperature, as measured by differential scanning calorimetry (DSC, heating rate:
- 20° C./minute), of from 230° C. to 350° C., wherein the transparent printed wiring substrate, when having a thickness of 50 μm, has a total light transmittance in accordance with JIS K7105 transparency test method of 85% or more.
Dependencies are inferred from the claim text.