Adhesion promotion in printed circuit boards
AssigneeEnthone Inc.
InventorsAbayomi I. Owei, Hiep X. Nguyen, Eric Yakobson
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Abstract
An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
Claims16
A process for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board, the process comprising:
- exposing the copper conducting layer to an adhesion promotion composition comprising a corrosion inhibitor, an inorganic acid, an oxidizing agent, and an alcohol or derivative thereof which is effective to increase copper-loading in the composition, wherein the adhesion promotion composition is initially substantially free of transition metals having a tendency to destabilize the oxidizing agent, to thereby yield a microroughened copper surface;
- wherein the concentration of the alcohol or derivative thereof is at least about 0.01 wt % and no greater than about 20 wt %.
An adhesion promotion composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board, the adhesion promotion composition comprising a corrosion inhibitor, an inorganic acid, an oxidizing agent, and an oligomeric alcohol or oligomeric alcohol derivative which is effective to increase copper-loading in the composition, wherein the adhesion promotion composition is initially substantially free of transition metals having a tendency to destabilize the oxidizing agent;
- wherein the alcohol or alcohol derivative is present in a concentration of at least about 0.01 wt % and no greater than about 20 wt %.
Dependencies are inferred from the claim text.