Y10S 425/228
Injection plunger or ram: transfer molding type
Y10S425/228 (Injection plunger or ram: transfer molding type) appears on 69 US grants and 4 published applications in this corpus.
Search patents in Y10S- Granted patents
- 69
- Published applications
- 4
- Assignees
- 35
- Inventors
- 96
- Latest grant
- 18 Apr 2006
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 4 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 9 | 0 |
| 1995 | 11 | 0 |
| 1996 | 6 | 0 |
| 1997 | 8 | 0 |
| 1998 | 8 | 0 |
| 1999 | 4 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 1 | 2 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Apparatus and method for molding simultaneously a plurality of semiconductor devices18 Apr 2006US 7,029,257 B2Samsung Electronics Co., Ltd.
- Molding apparatus including screw for molded articles of thermoplastic gas impregnated resin25 Nov 2003US 6,652,254 B2Sekisui Chemical Co., Ltd.
- Resin plunging apparatus for molding resin to seal an electronic device7 May 2002US 6,382,945 B1Industrial Technology Research Institute
- Method for encapsulating field windings of rotary electric machines7 Sep 1999US 5,948,338 AThe P. D. George Company
- Automated thermoset molding apparatus11 May 1999US 5,902,613 AThe Budd Company
- Thermistor assembly, temperature sensor, and manufacturing methods thereof2 Jan 2025US 2025/0003811 A1Yazaki Corporation
- Apparatus and method for molding simultaneously a plurality of semiconductor devices8 Jun 2006US 2006/0118982 A1Samsung Electronics Co., Ltd.
- Apparatus and method for molding simultaneously a plurality of semiconductor devices13 Nov 2003US 2003/0209817 A1Samsung Electronics Co., Ltd.
- Forming device for thermoplastic resin formed part6 Mar 2003US 2003/0044480 A1Sekisui Chemical Co., Ltd.
Most cited
By later US patents
- Encapsulation molding equipment195US 5,484,274 ANeu Dynamics Corp. · 1996
- Transfer molding apparatus having laminated chase block172US 5,871,782 ALG Semicon Co., Ltd. · 1999
- Apparatus for encapsulating electronic packages65US 5,609,889 AHestia Technologies, Inc. · 1997
- Apparatus for making oriented hollow plastic articles52US 3,966,378 A1976
- Method of and apparatus for molding resin to seal electronic parts49US 5,834,035 ATowa Corporation · 1998