Apparatus and method for molding simultaneously a plurality of semiconductor devices
AssigneeSamsung Electronics Co., Ltd.
InventorsSung-soo Lee, Dae-sung Lee, Kyung-soo Park
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Abstract
Provided is a molding apparatus for molding simultaneously a plurality of semiconductor devices. The molding apparatus includes a mold, a plurality of plungers, and a plunger block. The mold is prepared to mold a plurality of semiconductor devices. The plurality of plungers are plunged into the mold to inject a molding compound that will encapsulate the semiconductor devices in the mold. The plurality of plungers are assembled with the plunge block to operate at the same time. Each of the plurality of plungers includes a load sensor and/or a contact sensor, so as to sense separately whether the plungers are improperly operating.
Claims16
A molding apparatus comprising:
- a mold configured to mold simultaneously a plurality of semiconductor devices;
- a plurality of plungers for injecting a molding compound to encapsulate the semiconductor devices;
- a plunger block with which the plurality of plungers are assembled to operate at the same time;
- and
- a plurality of sensors for sensing whether the plungers operate improperly, each of the plurality of sensors being positioned between one end of a corresponding plunger and the bottom of the plunger block.
A molding apparatus comprising:
- a mold configured to mold simultaneously a plurality of semiconductor devices;
- a plurality of plungers having plunger protrusions for injecting a molding compound to encapsulate the semiconductor devices in the mold;
- a plunger block with which the plurality of plungers are assembled to operate at the same time;
- a limit bar for limiting movement of the plungers to a predetermined extent;
- and
- a plurality of contact sensors for respectively sensing whether respective plunger protrusions of the plungers contact the limit bar.
A molding apparatus comprising:
- a mold configured to mold simultaneously a plurality of semiconductor devices;
- a plurality of plungers having plunger protrusions for injecting a molding compound to encapsulate the semiconductor devices in the mold;
- a plunger block with which the plurality of plungers are assembled to operate at the same time;
- a limit bar for limiting movement of the plungers to a predetermined extent that prevents the plungers from deviating from the plunger block;
- a plurality of load sensors configured to sense respective pressures that are generated when the plurality of plungers operate;
- and
- a plurality of contact sensors configured to sense whether the respective plunger protrusions of the plurality of plungers contact the limit bar along with normal operation of the plungers.
Dependencies are inferred from the claim text.