Apparatus for encapsulating electronic packages
AssigneeHestia Technologies, Inc.
InventorPatrick O. Weber
Life of this patent
Estimating the term…
Abstract
A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink attached in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink. The mold is provided with a biased plug that exerts pressure on the heat sink or printed wiring board to prevent molding compound from covering the heat sink. The biased plug also accommodates variations in the thickness of the printed wiring board.
Claims4
An apparatus for encapsulating a laminate substrate having a heat sink thereon, comprising:
- a first mold platen having a recessed portion;
- a second mold platen for mating with the first mold platen to form a mold cavity adapted to receive the laminate substrate with the heat sink thereon, the second mold platen having a recessed portion and a support surface surrounding the recessed portion for supporting the laminate substrate;
- a member located in a cavity contiguous with the recessed portion in the first mold platen, the member having a width greater than the recessed portion of the second mold platen;
- and
- biasing means located in the contiguous cavity for urging the member into contact with the heat sink such that mold compound entering the apparatus is prevented from covering a surface of the heat sink in contact with the member and holding the laminate substrate flat against the support surface of the second mold platen.
Dependencies are inferred from the claim text.