Y10S 414/14
Wafer cassette transporting
Y10S414/14 (Wafer cassette transporting) appears on 790 US grants and 359 published applications in this corpus.
Search patents in Y10S- Granted patents
- 790
- Published applications
- 359
- Assignees
- 247
- Inventors
- 1,076
- Latest grant
- 6 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 5 | 0 |
| 1985 | 5 | 0 |
| 1986 | 5 | 0 |
| 1987 | 16 | 0 |
| 1988 | 18 | 0 |
| 1989 | 16 | 0 |
| 1990 | 22 | 0 |
| 1991 | 13 | 0 |
| 1992 | 5 | 0 |
| 1993 | 13 | 0 |
| 1994 | 12 | 0 |
| 1995 | 31 | 0 |
| 1996 | 24 | 0 |
| 1997 | 27 | 0 |
| 1998 | 26 | 0 |
| 1999 | 38 | 0 |
| 2000 | 54 | 0 |
| 2001 | 49 | 40 |
| 2002 | 71 | 55 |
| 2003 | 70 | 54 |
| 2004 | 47 | 32 |
| 2005 | 38 | 27 |
| 2006 | 26 | 28 |
| 2007 | 11 | 26 |
| 2008 | 18 | 23 |
| 2009 | 15 | 23 |
| 2010 | 33 | 16 |
| 2011 | 20 | 3 |
| 2012 | 12 | 8 |
| 2013 | 1 | 3 |
| 2014 | 12 | 6 |
| 2015 | 12 | 4 |
| 2016 | 4 | 2 |
| 2017 | 4 | 1 |
| 2018 | 2 | 4 |
| 2019 | 3 | 1 |
| 2020 | 1 | 1 |
| 2021 | 2 | 0 |
| 2022 | 1 | 1 |
| 2023 | 0 | 1 |
| 2024 | 1 | 0 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Tower lift, logistics system including the same, and transfer method using the same6 Jan 2026US 12,518,996 B2Semes Co., Ltd.
- Article accommodation facility8 Oct 2024US 12,112,966 B2Daifuku Co., Ltd.
- Article storage facility4 Oct 2022US 11,460,766 B2Daifuku Co., Ltd.
- Side opening unified pod14 Dec 2021US 11,201,070 B2Brooks Automation, Inc.
- Substrate processing method and substrate processing system20 Jul 2021US 11,069,548 B2Tokyo Electron Limited
- Tower lift, logistics system including the same, and transfer method using the same9 Mar 2023US 2023/0076551 A1Semes Co., Ltd.
- Article Accommodation Facility1 Dec 2022US 2022/0380124 A1Daifuku Co., Ltd.
- Article Storage Facility20 Aug 2020US 2020/0264506 A1Daifuku Co., Ltd.
- Substrate processing method and substrate processing system28 Nov 2019US 2019/0362996 A1Tokyo Electron Limited
- Side opening unified pod20 Sep 2018US 2018/0269094 A1Brooks Automation, Inc.
Most cited
By later US patents
- High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock573US 6,048,154 AAPPLIED Materials.Inc. · 2000
- Direct loadlock interface538US 5,586,585 AAsyst Technologies, Inc. · 1996
- Method and device for transferring wafers525US 6,481,945 B1ASM International N.V. · 2002
- Treatment apparatus498US 5,562,383 ATokyo Electron Limited · 1996
- Apparatus for securing an automatically loaded wafer cassette on a wafer processing equipment493US 5,246,218 AIntel Corporation · 1993