Y10S 204/07
Current distribution within the bath
Y10S204/07 (Current distribution within the bath) appears on 187 US grants and 55 published applications in this corpus.
Search patents in Y10S- Granted patents
- 187
- Published applications
- 55
- Assignees
- 97
- Inventors
- 341
- Latest grant
- 5 Aug 2014
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 11 | 0 |
| 1977 | 6 | 0 |
| 1978 | 5 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 5 | 0 |
| 1982 | 6 | 0 |
| 1983 | 7 | 0 |
| 1984 | 10 | 0 |
| 1985 | 5 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 10 | 0 |
| 2001 | 21 | 4 |
| 2002 | 15 | 17 |
| 2003 | 10 | 2 |
| 2004 | 8 | 9 |
| 2005 | 4 | 10 |
| 2006 | 3 | 3 |
| 2007 | 5 | 1 |
| 2008 | 4 | 3 |
| 2009 | 5 | 1 |
| 2010 | 1 | 2 |
| 2011 | 3 | 2 |
| 2012 | 2 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Device and method to conduct an electrochemical reaction on a surface of a semi-conductor substrate5 Aug 2014US 8,795,503 B2Alchimer
- Apparatus for an enhanced magnetic plating method1 May 2012US 8,168,045 B2International Business Corporation
- Semiconductive counter electrode for electrolytic current distribution control3 Apr 2012US 8,147,660 B1Novellus Systems, Inc.
- Method of electroplating using a high resistance ionic current source28 Jun 2011US 7,967,969 B2Novellus Systems, Inc.
- Enhanced magnetic plating method21 Jun 2011US 7,964,081 B2International Business Machines Corporation
- Device and method to conduct an electrochemical reaction on a surface of a semi-conductor substrate5 Jan 2012US 2012/0000785 A1Alchimer
- Enhanced magnetic plating method15 Sep 2011US 2011/0220020 A1International Business Machines Corporation
- Electroplating apparatus based on an array of anodes18 Aug 2011US 2011/0198229 A1Applied Materials, Inc.
- Apparatus and method for electrochemically depositing metal on a semiconductor workpiece13 May 2010US 2010/0116671 A1Semitool, Inc.
- High Resistance Ionic Current Source11 Feb 2010US 2010/0032304 A1Novellus Systems, Inc.
Most cited
By later US patents
- Method for electrochemically depositing metal on a semiconductor workpiece328US 6,565,729 B2Semitool, Inc. · 2003
- Plating cell with horizontal product load mechanism314US 5,932,077 AReynolds Tech Fabricators, Inc. · 1999
- Rotary electroplating cell with controlled current distribution234US 4,304,641 AInternational Business Machines Corporation · 1981
- Vertical paddle plating cell223US 5,516,412 AInternational Business Machines Corporation · 1996
- Method and apparatus for spatially uniform electropolishing and electrolytic etching211US 5,096,550 AThe United States of America as represented by the United States Department of Energy · 1992