Y10S 156/915
Differential etching apparatus including focus ring surrounding a wafer for plasma apparatus
Y10S156/915 (Differential etching apparatus including focus ring surrounding a wafer for plasma apparatus) appears on 92 US grants and 57 published applications in this corpus.
Search patents in Y10S- Granted patents
- 92
- Published applications
- 57
- Assignees
- 32
- Inventors
- 184
- Latest grant
- 1 Dec 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 9 | 0 |
| 2000 | 4 | 0 |
| 2001 | 8 | 4 |
| 2002 | 4 | 5 |
| 2003 | 6 | 6 |
| 2004 | 5 | 4 |
| 2005 | 4 | 7 |
| 2006 | 2 | 7 |
| 2007 | 2 | 3 |
| 2008 | 6 | 4 |
| 2009 | 4 | 3 |
| 2010 | 5 | 2 |
| 2011 | 4 | 3 |
| 2012 | 4 | 3 |
| 2013 | 5 | 1 |
| 2014 | 0 | 1 |
| 2015 | 2 | 1 |
| 2016 | 2 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 2 | 1 |
| 2021 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Plasma processing apparatus and method1 Dec 2020US 10,854,431 B2Tokyo Electron Limited
- Plasma processing apparatus and method28 Jan 2020US 10,546,727 B2Tokyo Electron Limited
- Plasma processing apparatus and method8 Nov 2016US 9,490,105 B2Tokyo Electron Limited
- Etching method, etching apparatus, and ring member13 Sep 2016US 9,441,292 B2Tokyo Electron Limited
- Apparatus and methods for edge ring implementation for substrate processing10 Nov 2015US 9,184,074 B2Lam Research Corporation
- Plasma processing apparatus and method18 Mar 2021US 2021/0082669 A1Tokyo Electron Limited
- Plasma processing apparatus and method9 Apr 2020US 2020/0111645 A1Tokyo Electron Limited
- Plasma processing apparatus and method29 Dec 2016US 2016/0379805 A1Tokyo Electron Limited
- Etching method, etching apparatus, and ring member23 Jul 2015US 2015/0206763 A1Tokyo Electron Limited
- Plasma processing apparatus and method8 May 2014US 2014/0124139 A1Tokyo Electron Limited
Most cited
By later US patents
- Focus ring for semiconductor wafer processing in a plasma reactor469US 5,685,914 AAPPLIED Materials.Inc. · 1997
- Process kit288US 6,189,483 B1APPLIED Materials.Inc. · 2001
- Plasma processing apparatus275US 5,919,332 ATokyo Electron Limited · 1999
- Plasma processing apparatus208US 5,529,657 ATokyo Electron Limited · 1996
- Perforated plasma confinement ring in plasma reactors113US 6,178,919 B2Lam Research Corporation · 2001