Y10S 156/914
Differential etching apparatus including particular materials of construction
Y10S156/914 (Differential etching apparatus including particular materials of construction) appears on 91 US grants and 19 published applications in this corpus.
Search patents in Y10S- Granted patents
- 91
- Published applications
- 19
- Assignees
- 42
- Inventors
- 172
- Latest grant
- 28 Feb 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 6 | 0 |
| 1997 | 6 | 0 |
| 1998 | 9 | 0 |
| 1999 | 14 | 0 |
| 2000 | 7 | 0 |
| 2001 | 5 | 0 |
| 2002 | 3 | 4 |
| 2003 | 3 | 3 |
| 2004 | 4 | 4 |
| 2005 | 1 | 1 |
| 2006 | 0 | 1 |
| 2007 | 3 | 1 |
| 2008 | 2 | 1 |
| 2009 | 0 | 0 |
| 2010 | 2 | 1 |
| 2011 | 0 | 0 |
| 2012 | 1 | 1 |
| 2013 | 2 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for fabricating chamber parts28 Feb 2023US 11,591,689 B2APPLIED Materials.Inc.
- Method for backside polymer reduction in dry-etch process10 Sep 2013US 8,529,783 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Plasma confinement rings having reduced polymer deposition characteristics6 Aug 2013US 8,500,952 B2Lam Research Corporation
- Plasma confinement rings having reduced polymer deposition characteristics11 Sep 2012US 8,262,922 B2Lam Research Corporation
- Method and apparatus for backside polymer reduction in dry-etch process11 May 2010US 7,713,380 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for fabricating chamber parts1 Jun 2023US 2023/0167543 A1APPLIED Materials.Inc.
- Method for fabricating chamber parts27 Aug 2020US 2020/0270747 A1APPLIED Materials.Inc.
- Plasma confinement rings having reduced polymer deposition characteristics27 Dec 2012US 2012/0325407 A1Lam Research Corporation
- Method for backside polymer reduction in dry-etch process29 Jul 2010US 2010/0190349 A1Taiwan Semiconductor Manufacturing Company, Ltd.
- Plasma confinement rings assemblies having reduced polymer deposition characteristics25 Dec 2008US 2008/0318433 A1Lam Research Corporation
Most cited
By later US patents
- Composite electrode for plasma processes322US 5,074,456 ALam Research Corporation · 1991
- Method and apparatus for protection of conductive surfaces in a plasma processing reactor319US 5,366,585 AAPPLIED Materials.Inc. · 1994
- Boron carbide parts and coatings in a plasma reactor275US 6,120,640 AAPPLIED Materials.Inc. · 2000
- Device for plasma process188US 5,272,417 A1993
- Electrostatic chuck with an impregnated, porous layer that exhibits the Johnson-Rahbeck effect161US 5,916,689 AAPPLIED Materials.Inc. · 1999