Plasma confinement rings having reduced polymer deposition characteristics
AssigneeLam Research Corporation
InventorsRajinder Dhindsa, Felix Kozakevich, James H. Rogers, David Trussell
Life of this patent
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Abstract
Plasma confinement ring assemblies are provided that include confinement rings adapted to reach sufficiently high temperatures on plasma-exposed surfaces of the rings to avoid polymer deposition on those surfaces. The plasma confinement rings include thermal chokes adapted to localize heating at selected portions of the rings that include the plasma exposed surfaces. The thermal chokes reduce heat conduction from those portions to other portions of the rings, which causes selected portions of the rings to reach desired temperatures during plasma processing.
Claims20
A plasma confinement ring assembly for a plasma processing chamber, comprising a plurality of plasma confinement rings each including an inner portion having a plasma-exposed inner diametric surface, an outer portion disposed radially outwardly from the inner portion, and at least one thermal choke adapted to reduce heat conduction from the inner portion to the outer portion when the inner diametric surface is exposed to plasma in the plasma processing chamber, such that the inner diametric surface reaches a sufficiently high temperature to substantially prevent polymer deposition thereon wherein each plasma confinement rings comprises inner and outer portions which are separate annular pieces of dielectric material defining the at least one thermal choke therebetween.
A plasma confinement ring assembly for a plasma processing chamber, comprising:
- a mounting ring;
- and
- a plurality of plasma confinement rings suspended below the mounting ring, the plasma confinement rings comprise an upper plasma confinement ring and a plurality of lower plasma confinement rings, the lower plasma confinement rings each include an inner diametric surface, the upper plasma confinement ring includes a top surface facing the mounting ring and a plasma-exposed bottom surface disposed radially inward from the inner diametric surface of each of the lower plasma confinement rings, at least a portion of the top surface of the upper plasma confinement ring is adapted to block IR radiation to thereby enhance heating of the upper plasma confinement ring such that the bottom surface reaches a sufficiently high temperature to substantially prevent polymer deposition thereon when the bottom surface is exposed to the plasma wherein the plasma confinement rings each include an annular inner portion and a separate annular outer portion comprising thermal chokes therebetween.
A plasma confinement ring for a plasma confinement ring assembly for a plasma processing chamber, the plasma confinement ring comprising:
- an inner portion having an inner diametric surface adapted to be exposed to plasma in the plasma processing chamber;
- an outer portion disposed radially outwardly from the inner portion;
- and
- at least one thermal choke adapted to reduce heat conduction from the inner portion to the outer portion when the inner diametric surface is exposed to plasma in the plasma processing chamber, such that the inner diametric surface reaches a sufficiently high temperature to substantially prevent polymer deposition thereon wherein the inner portion is an inner ring including the inner diametric surface, the outer portion is an outer ring having an upper surface supporting a lower surface of the inner ring, and at least one annular gap forming a thermal choke is defined between opposed surfaces of the inner ring and outer ring.
Dependencies are inferred from the claim text.