Y10S 148/162
Testing steps
Y10S148/162 (Testing steps) appears on 33 US grants and 0 published applications in this corpus.
Search patents in Y10S- Granted patents
- 33
- Published applications
- 0
- Assignees
- 24
- Inventors
- 83
- Latest grant
- 8 May 2001
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method of forming semiconductor devices using gate insulator thickness and channel length for controlling drive current strength8 May 2001US 6,228,663 B1Advanced Micro Devices, Inc.
- Semiconductor wafer evaluation method1 May 2001US 6,225,137 B1Oki Electric Industry Co., Ltd.
- Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information9 Jan 2001US 6,171,873 B2International Business Machines Corporation
- Sensitive technique for metal-void detection8 Aug 2000US 6,100,101 AAdvanced Micro Devices, Inc.
- Semiconductor wafer evaluating method and semiconductor device manufacturing method31 Aug 1999US 5,946,543 AMitsubishi Denki Kabushiki
No published applications in this class yet.
Most cited
By later US patents
- Method for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication process124US 5,219,765 AHitachi, Ltd. · 1993
- Method of die burn-in84US 5,489,538 ALSI Logic Corporation · 1996
- Arrangement and method for detecting sequential processing effects in manufacturing using predetermined sequences within runs76US 5,930,138 AAdvanced Micro Devices, Inc. · 1999
- Method of reducing dice testing with on-chip identification66US 5,360,747 AXilinx, Inc. · 1994
- Method for testing semiconductor devices48US 5,298,433 AKabushiki Kaisha Toshiba · 1994