Y10S 148/006
Apparatus
Y10S148/006 (Apparatus) appears on 46 US grants and 0 published applications in this corpus.
Search patents in Y10S- Granted patents
- 46
- Published applications
- 0
- Assignees
- 33
- Inventors
- 102
- Latest grant
- 1 Oct 1996
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 2 | 0 |
| 1978 | 4 | 0 |
| 1979 | 7 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Heating method and manufacturing method for semiconductor device1 Oct 1996US 5,561,088 ASony Corporation
- Apparatus for manufacturing a liquid crystal display substrate, and apparatus for evaluating semiconductor crystals25 Jun 1996US 5,529,630 ATokyo Electron Limited
- Process for uniform deposition of tungsten silicide on semiconductor wafers by treatment of susceptor having aluminum nitride surface thereon with tungsten silicide after cleaning of susceptor23 Apr 1996US 5,510,297 AAPPLIED Materials.Inc.
- Method for manufacturing a liquid crystal display substrate9 May 1995US 5,413,958 ATokyo Electron Limited
- Gas-based backside protection during substrate processing20 Dec 1994US 5,374,594 ANovellus Systems, Inc.
No published applications in this class yet.
Most cited
By later US patents
- Staged-vacuum wafer processing system and method701US 5,186,718 AAPPLIED Materials.Inc. · 1993
- Method of forming conductive layer including removal of native oxide257US 4,985,372 ATokyo Electron Limited · 1991
- Method for manufacturing a liquid crystal display substrate141US 5,413,958 ATokyo Electron Limited · 1995
- Apparatus for forming thin-film heterojunction solar cells employing materials selected from the class of I-III-VI.sub.2 chalcopyrite compounds113US 4,392,451 AThe Boeing Company · 1983
- Process for preparing semiconductor wafers with substantially no crystallographic slip107US 4,081,313 AAPPLIED Materials.Inc. · 1978