H10W 40/033
Using mechanical treatments
Official title: {using mechanical treatments, e.g. deforming, punching or cutting}
H10W40/033 (Using mechanical treatments) appears on 0 US grants and 8 published applications in this corpus.
Search patents in H10W- Granted patents
- 0
- Published applications
- 8
- Assignees
- 8
- Inventors
- 25
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
| 2026 | 0 | 6 |
By publication year. 2026 runs to 8 Oct.
Recent patents
No granted patents in this class yet.
- Cold plate6 Aug 2026US 2026/0231359 A1LG Electronics Inc.
- Heat sink for a semiconductor package, panel-level heat sink array and related manufacturing method16 Jul 2026US 2026/0206581 A1Chengdu Monolithic Power Systems Co., Ltd.
- Tim-free heat spreader18 Jun 2026US 2026/0173866 A1Board of Regents, The University of Texas System
- Heat dissipation member, heat dissipation member manufacturing method, package, and substrate23 Apr 2026US 2026/0114276 A1Ngk Electronics Devices, Inc.
- Heat sink and manufacturing process19 Mar 2026US 2026/0082516 A1
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By later US patents
No patent in this class has been cited by a later US patent yet.