Tim-free heat spreader

Abstract

A heat spreader placed in connection with a heat generating device. The heat spreader includes patterned regions with interspersed bulk semiconductor and thermally conductive material. Furthermore, the heat spreader includes tapered structures that cause thermal conductivity and/or thermal expansion in the heat spreader to gradually change from that of the heat generating device to that of the thermally conductive material. In this manner, the design and performance of heat spreaders is improved by eliminating the need for utilizing the thermal interface material.

Dependencies are inferred from the claim text.