H10N 30/872
Interconnections
Official title: {Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices}
H10N30/872 (Interconnections) appears on 626 US grants and 719 published applications in this corpus.
Search patents in H10N- Granted patents
- 626
- Published applications
- 719
- Assignees
- 226
- Inventors
- 1,372
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 6 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 6 | 0 |
| 2001 | 9 | 6 |
| 2002 | 10 | 16 |
| 2003 | 11 | 9 |
| 2004 | 13 | 14 |
| 2005 | 10 | 23 |
| 2006 | 17 | 25 |
| 2007 | 21 | 21 |
| 2008 | 13 | 14 |
| 2009 | 15 | 15 |
| 2010 | 20 | 18 |
| 2011 | 12 | 17 |
| 2012 | 11 | 15 |
| 2013 | 11 | 32 |
| 2014 | 12 | 33 |
| 2015 | 30 | 45 |
| 2016 | 35 | 35 |
| 2017 | 35 | 47 |
| 2018 | 32 | 38 |
| 2019 | 41 | 48 |
| 2020 | 29 | 48 |
| 2021 | 34 | 37 |
| 2022 | 46 | 41 |
| 2023 | 43 | 36 |
| 2024 | 26 | 21 |
| 2025 | 28 | 37 |
| 2026 | 27 | 28 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Boundary acoustic wave device with multi-layer piezoelectric substrate29 Sep 2026US 12,750,030 B2Skyworks Solutions, Inc.
- MEMS sensor with a thin region1 Sep 2026US 12,726,773 B2Skyworks Solutions, Inc.
- Vibration apparatus and sound apparatus including the same1 Sep 2026US 12,727,384 B2LG Display Co., Ltd.
- Acoustic sensor systems with different heights25 Aug 2026US 12,718,614 B2QUALCOMM Incorporated
- Piezoelectric actuator25 Aug 2026US 12,721,041 B2KYOCERA Corporation
- Piezoelectric element, liquid ejecting head, and liquid ejecting apparatus13 Aug 2026US 2026/0239883 A1Seiko Epson Corporation
- Piezoelectric actuator, liquid ejection head and recording device6 Aug 2026US 2026/0231683 A1KYOCERA Corporation
- Piezoelectric Device with Cantilever Configuration and Metamaterial for Enhanced Piezoelectric Response30 Jul 2026US 2026/0223598 A1
- Acoustic wave devices with thermal bypass23 Jul 2026US 2026/0213726 A1Skyworks Solutions, Inc.
- Haptic response integrated circuit device with piezoelectric structures2 Jul 2026US 2026/0190864 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Electromechanical transducer297US 6,946,779 B2Endress + Hauser GmbH + Co. KG · 2005
- Laminated structure and method of manufacturing the same114US 7,061,166 B2Fuji Photo Film Co., Ltd. · 2006
- Multi-layer composite ultrasonic transducer arrays96US 5,548,564 ADuke University · 1996
- Two-dimensional array ultrasonic transducers92US 5,329,496 ADuke University · 1994
- Surface deformation electroactive polymer transducers84US 8,222,799 B2Bayer MaterialScience AG · 2012