H10N 30/874
Embedded within piezoelectric or electrostrictive material
Official title: {embedded within piezoelectric or electrostrictive material, e.g. via connections}
H10N30/874 (Embedded within piezoelectric or electrostrictive material) appears on 150 US grants and 181 published applications in this corpus.
Search patents in H10N- Granted patents
- 150
- Published applications
- 181
- Assignees
- 88
- Inventors
- 373
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 1 |
| 2002 | 0 | 5 |
| 2003 | 3 | 2 |
| 2004 | 2 | 5 |
| 2005 | 2 | 15 |
| 2006 | 10 | 7 |
| 2007 | 10 | 8 |
| 2008 | 5 | 4 |
| 2009 | 3 | 4 |
| 2010 | 5 | 4 |
| 2011 | 4 | 4 |
| 2012 | 3 | 2 |
| 2013 | 3 | 7 |
| 2014 | 2 | 5 |
| 2015 | 3 | 6 |
| 2016 | 3 | 8 |
| 2017 | 7 | 6 |
| 2018 | 5 | 7 |
| 2019 | 2 | 8 |
| 2020 | 7 | 15 |
| 2021 | 4 | 15 |
| 2022 | 7 | 12 |
| 2023 | 15 | 9 |
| 2024 | 10 | 8 |
| 2025 | 10 | 10 |
| 2026 | 7 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Boundary acoustic wave device with multi-layer piezoelectric substrate29 Sep 2026US 12,750,030 B2Skyworks Solutions, Inc.
- Vibration device and apparatus comprising same21 Apr 2026US 12,610,196 B2LG Display Co., Ltd.
- Piezoelectric device14 Apr 2026US 12,604,667 B2Murata Manufacturing Co., Ltd.
- Piezoelectric element24 Mar 2026US 12,588,417 B2Denso Corporation
- Stacked piezoelectric actuator with through-hole connection electrodes17 Mar 2026US 12,580,498 B2New Shicoh Motor Co., Ltd.
- Converting element and vibronic sensor30 Apr 2026US 2026/0123287 A1CTS Corporation Advanced Materials and Solutions
- Device comprising an acoustic layer and via interconnect9 Apr 2026US 2026/0101673 A1RF360 Singapore Pte. Ltd.
- A Dual Bimorph Assembly19 Feb 2026US 2026/0052907 A1QorTek, Inc.
- Method of Making a Biomorph Assembly12 Feb 2026US 2026/0047342 A1QorTek, Inc.
- Piezoelectric element18 Dec 2025US 2025/0386733 A1TDK Corporation
Most cited
By later US patents
- Laminated structure and method of manufacturing the same114US 7,061,166 B2Fuji Photo Film Co., Ltd. · 2006
- Multi-layer composite ultrasonic transducer arrays96US 5,548,564 ADuke University · 1996
- Two-dimensional array ultrasonic transducers92US 5,329,496 ADuke University · 1994
- Surface deformation electroactive polymer transducers84US 8,222,799 B2Bayer MaterialScience AG · 2012
- Multilayer electrostrictive element which withstands repeated application of pulses78US 4,523,121 ANEC Corporation · 1985