Method of Making a Biomorph Assembly

A method of making a high temperature and high pressure withstand capable wire-free, adhesive-free bimorph assembly:

• applying a first thin conductive ink layer to a top and bottom side of a first and a second transductive element;
• applying a first conductive ink layer to a top and bottom side of a central metal layer;
• applying a first conductive ink layer to a first side of the outer top metal layer and the outer bottom metal layer;
• drying the first conductive ink layers of the first and second transductive elements, the central metal layer, the outer top metal layer and the outer bottom metal layer;
• applying a second conductive ink layer to a top and bottom side of a first and a second transductive element;
• applying a second conductive ink layer to a top and bottom side of a central metal layer;
• applying a second conductive ink layer to a first side of the outer top metal layer and the outer bottom metal layer;
• stacking the perforated outer bottom metal layer, second transductive element, perforated central metal layer, a first transductive element, and a perforated outer top metal layer to form a laminar structure;
• applying uniform and continuous pressure to the bottom and top surfaces of the laminar structure;
• thermal cycling the laminar structure according to a thermal profile that causes suffusion of the thin conductive ink layers into the metal perforations and the transductive element surface;
• removing the pressure from the bottom and top surfaces of the laminar structure;
• applying an electric field to the central metal layer, the outer top metal layer, and the outer
• bottom metal layer.