H10K 71/50

Forming devices by joining two substrates together

Official title: Forming devices by joining two substrates together, e.g. lamination techniques

H10K71/50 (Forming devices by joining two substrates together) appears on 600 US grants and 785 published applications in this corpus.

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Granted patents
600
Published applications
785
Assignees
227
Inventors
1,406
Latest grant
15 Sep 2026

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H10K 71/50: granted patents and published applications per publication year
YearGranted patentsPublished applications
199310
199400
199500
199600
199700
199800
199910
200010
200112
200276
2003724
2004825
20051524
20061747
20071728
2008179
20091720
20102721
20112025
20121828
20132226
20142221
20152855
20163357
20173642
20184248
20195641
20202835
20212548
20223136
20232330
20242939
20253832
20261316

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

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